Block-level 3-D Global Routing With an Application to 3-D Packaging

Three-dimensional (3-D) packaging via system-on-a-package (SOP) has been recently proposed as an alternative solution to overcome the limitation of system-on-a-chip (SOC) and meet the rigorous requirements of today's mixed signal system integration. The true potential of SOP technology lies in...

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Bibliographic Details
Published in:IEEE transactions on computer-aided design of integrated circuits and systems 2006-10, Vol.25 (10), p.2248-2257
Main Authors: Minz, J., Sung Kyu Lim
Format: Article
Language:English
Subjects:
3-D global routing
3-D packaging
Algorithms
Blocking
Circuit boards
Density
Design automation
Integrated circuit technology
Jacobian matrices
Mathematical models
Multichip modules
Packaging
Pins
Printed circuits
Routers
Routing
Semiconductor device packaging
Studies
Substrates
System-on-a-chip
System-on-a-package
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Summary:Three-dimensional (3-D) packaging via system-on-a-package (SOP) has been recently proposed as an alternative solution to overcome the limitation of system-on-a-chip (SOC) and meet the rigorous requirements of today's mixed signal system integration. The true potential of SOP technology lies in its capability to integrate both active and passive components into a single high speed/density 3-D packaging substrate. The routing environment for 3-D SOP is more advanced than that of the conventional printed circuit board (PCB) or multichip module (MCM) technology - pins are located at all layers of the SOP packaging substrate rather than the topmost layer only, and various types of vias are available for layer-to-layer connections. The contribution of this work is to provide: 1) the formulation of the new block-level 3-D global routing problem under wire length, layer, crosstalk, and congestion minimization and 2) the first global router for 3-D SOP named 3PGR. This paper reviews various approaches for MCM routing algorithms and investigates their applicability to the SOP model. The related experimental results demonstrate the effectiveness of the algorithms
ISSN:0278-0070
1937-4151
DOI:10.1109/TCAD.2005.860952