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An 800-MHz embedded DRAM with a concurrent refresh mode

An 800-MHz embedded DRAM macro employs a memory cell utilizing a device from the 90-nm high-performance technology menu; a 2.2-nm gate oxide 1.5 V IO device. A concurrent refresh mode is designed to improve the memory utilization to over 99% for a 64 /spl mu/s data retention time. A concurrent refre...

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Bibliographic Details
Published in:IEEE journal of solid-state circuits 2005-06, Vol.40 (6), p.1377-1387
Main Authors: Kirihata, T., Parries, P., Hanson, D.R., Hoki Kim, Golz, J., Fredeman, G., Rajeevakumar, R., Griesemer, J., Robson, N., Cestero, A., Khan, B.A., Geng Wang, Wordeman, M., Iyer, S.S.
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Language:English
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Summary:An 800-MHz embedded DRAM macro employs a memory cell utilizing a device from the 90-nm high-performance technology menu; a 2.2-nm gate oxide 1.5 V IO device. A concurrent refresh mode is designed to improve the memory utilization to over 99% for a 64 /spl mu/s data retention time. A concurrent refresh scheduler utilizes up-count and down-count registers to identify at least one array to be refreshed at every clock cycle, emulating a classical distributed refresh mode. A command multiplier employs low frequency phased clock signals to generate the clock, commands, and addresses at rates up to 4/spl times/ that of the tester frequency. The macro integrates masked redundancy allocation logic during at speed multibank test. The hardware results show a 312-MHz random access frequency and 800-MHz multibank frequency at 1.2 V, respectively.
ISSN:0018-9200
1558-173X
DOI:10.1109/JSSC.2005.848019