Simulating the Electrical Behavior of Integrated Circuit Devices in the Presence of Thermal Interactions

This paper describes a cosimulation methodology for modeling the electrical behavior of integrated circuit devices in the presence of thermal interactions. The methodology consists of linking a custom finite-volume thermal simulator to a commercially available electrical simulator (Saber, Synopsys,...

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Bibliographic Details
Published in:IEEE transactions on computer-aided design of integrated circuits and systems 2006-10, Vol.25 (10), p.2231-2241
Main Authors: Capobianchi, M., Labay, V., Fong Shi, Mizushima, G.
Format: Article
Language:English
Subjects:
Central Processing Unit
Circuit simulation
Computational modeling
Computer aided design
Computer simulation
Design engineering
Devices
Electrothermal effects
Electrothermal interactions
electrothermal modeling
electrothermal simulation
Integrated circuit modeling
Integrated circuits
Joining processes
Mathematical models
Mechanical engineering
Methodology
Operational amplifiers
Power dissipation
Temperature
thermal coupling
Thermal simulators
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Summary:This paper describes a cosimulation methodology for modeling the electrical behavior of integrated circuit devices in the presence of thermal interactions. The methodology consists of linking a custom finite-volume thermal simulator to a commercially available electrical simulator (Saber, Synopsys, Inc.). Specifically, this paper delineates the techniques developed to resolve the time- and length-scale issues associated with this type of cosimulation that, if left unresolved, typically lead to poor computational performance. These problems, their solutions, and their implementation into the thermal simulator are exposed in detail
ISSN:0278-0070
1937-4151
DOI:10.1109/TCAD.2005.859488