De-embedding procedure based on computed/measured data set for pcb structures characterization

This paper uses a de-embedding procedure, based on measured and numerically computed S-parameters, to obtain the characterization of portions of a structure difficult to obtain by direct measurements. The results are validated by measurements and independent calculations.

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Bibliographic Details
Published in:IEEE transactions on advanced packaging 2004-11, Vol.27 (4), p.597-602
Main Authors: Antonini, G., Scogna, A.C., Orlandi, A.
Format: Article
Language:English
Subjects:
Applied sciences
Circuit simulation
Computation
Computational modeling
Connectors
De-embedding
Electromagnetic analysis
Electromagnetic measurements
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Fixtures
full wave modeling
Mathematical analysis
Mathematical models
Matrix converters
Numerical simulation
Packaging
S-parameters
Scattering parameters
SMA connectors
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Description
Summary:This paper uses a de-embedding procedure, based on measured and numerically computed S-parameters, to obtain the characterization of portions of a structure difficult to obtain by direct measurements. The results are validated by measurements and independent calculations.
ISSN:1521-3323
1557-9980
DOI:10.1109/TADVP.2004.831849