Advanced acoustic microimaging using sparse signal representation for the evaluation of microelectronic packages

Acoustic microimaging (AMI) has been widely used to nondestructively evaluate microelectronic packages for the presence of internal defects. To detect defects in small devices such as /spl mu/BGA, flip-chip, and chip-scale packages, high acoustic frequencies are required for the conventional AMI sys...

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Bibliographic Details
Published in:IEEE transactions on advanced packaging 2006-05, Vol.29 (2), p.271-283
Main Authors: Guang-Ming Zhang, Harvey, D.M., Braden, D.R.
Format: Article
Language:English
Subjects:
Acoustic devices
Acoustic frequencies
Acoustic materials
Acoustic measurement
Acoustic microimaging (AMI)
Acoustic signal detection
Acoustics
Ambient intelligence
Applied sciences
Chip scale packaging
Defects
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Frequency
Integrated circuits
microelectronic packages
Microelectronics
overcomplete dictionaries
Packages
Representations
Robustness
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Signal representations
Signal resolution
sparse signal representations
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Summary:Acoustic microimaging (AMI) has been widely used to nondestructively evaluate microelectronic packages for the presence of internal defects. To detect defects in small devices such as /spl mu/BGA, flip-chip, and chip-scale packages, high acoustic frequencies are required for the conventional AMI systems. The acoustic frequency used in practice, however, is limited by its penetration through materials. In this paper, a novel acoustic microimaging technique, which utilizes nonlinear signal processing techniques to improve the resolution and robustness of conventional AMI, is proposed and investigated. The technique is based on the concept of sparse signal representations in overcomplete time-frequency dictionaries. Simulation and experimental results show its super resolution and high robustness.
ISSN:1521-3323
1557-9980
DOI:10.1109/TADVP.2005.853553