Advanced acoustic microimaging using sparse signal representation for the evaluation of microelectronic packages

• Published in: IEEE transactions on advanced packaging 2006-05, Vol.29 (2), p.271-283
• Main Authors: Guang-Ming Zhang, Harvey, D.M., Braden, D.R.
• Format: Article
• Language: English
• Subjects: Acoustic devices; Acoustic frequencies; Acoustic materials; Acoustic measurement; Acoustic microimaging (AMI); Acoustic signal detection; Acoustics; Ambient intelligence; Applied sciences; Chip scale packaging; Defects; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; Frequency; Integrated circuits; microelectronic packages; Microelectronics; overcomplete dictionaries; Packages; Representations; Robustness; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Signal representations; Signal resolution; sparse signal representations
• ISSN: 1521-3323; 1557-9980
• DOI: 10.1109/TADVP.2005.853553

Acoustic microimaging (AMI) has been widely used to nondestructively evaluate microelectronic packages for the presence of internal defects. To detect defects in small devices such as /spl mu/BGA, flip-chip, and chip-scale packages, high acoustic frequencies are required for the conventional AMI systems. The acoustic frequency used in practice, however, is limited by its penetration through materials. In this paper, a novel acoustic microimaging technique, which utilizes nonlinear signal processing techniques to improve the resolution and robustness of conventional AMI, is proposed and investigated. The technique is based on the concept of sparse signal representations in overcomplete time-frequency dictionaries. Simulation and experimental results show its super resolution and high robustness.