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Structural and dielectric properties of Ru-based gate/Hf-doped Ta2O5 stacks

Hf-doped Ta2O5 thin films are studied with respect to their composition, dielectric and electrical properties. The incorporation of Hf is performed by sputtering of a 0.7nm thick Hf layer on top of Ta2O5 and subsequent annealing to stimulate diffusion of Hf into Ta2O5 and their intermixing. The elem...

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Bibliographic Details
Published in:Applied surface science 2011-06, Vol.257 (17), p.7876-7880
Main Authors: PASKALEVA, A, TAPAJNA, M, DOBROCKA, E, HUSEKOVA, K, ATANASSOVA, E, FRĂ–HLICH, K
Format: Article
Language:English
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Summary:Hf-doped Ta2O5 thin films are studied with respect to their composition, dielectric and electrical properties. The incorporation of Hf is performed by sputtering of a 0.7nm thick Hf layer on top of Ta2O5 and subsequent annealing to stimulate diffusion of Hf into Ta2O5 and their intermixing. The elemental in-depth distribution of the films is investigated by the time of flight secondary ion mass spectroscopy (ToF-SIMS), which has revealed that Hf and Ta2O5 are intermixed throughout the whole thickness. Two sub-layers exist in all the samples - an upper homogeneous Hf-doped Ta2O5 sub-layer and a near interfacial region which is a mixture of Ta- and Si-oxides. The X-ray reflectivity (XRR) analysis shows existence of interfacial layer with a thickness of about 1.9-2nm, irrespectively of the total thickness of the stacks. Metal-oxide-Si structures with Ru and RuO2 metal electrodes have been prepared and investigated in terms of dielectric constant, effective work function (EWF) and interfacial layer parameters. The influence of post-metallization annealing steps on these parameters was also studied.
ISSN:0169-4332
1873-5584
DOI:10.1016/j.apsusc.2011.04.062