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Structural and dielectric properties of Ru-based gate/Hf-doped Ta2O5 stacks
Hf-doped Ta2O5 thin films are studied with respect to their composition, dielectric and electrical properties. The incorporation of Hf is performed by sputtering of a 0.7nm thick Hf layer on top of Ta2O5 and subsequent annealing to stimulate diffusion of Hf into Ta2O5 and their intermixing. The elem...
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Published in: | Applied surface science 2011-06, Vol.257 (17), p.7876-7880 |
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Main Authors: | , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Hf-doped Ta2O5 thin films are studied with respect to their composition, dielectric and electrical properties. The incorporation of Hf is performed by sputtering of a 0.7nm thick Hf layer on top of Ta2O5 and subsequent annealing to stimulate diffusion of Hf into Ta2O5 and their intermixing. The elemental in-depth distribution of the films is investigated by the time of flight secondary ion mass spectroscopy (ToF-SIMS), which has revealed that Hf and Ta2O5 are intermixed throughout the whole thickness. Two sub-layers exist in all the samples - an upper homogeneous Hf-doped Ta2O5 sub-layer and a near interfacial region which is a mixture of Ta- and Si-oxides. The X-ray reflectivity (XRR) analysis shows existence of interfacial layer with a thickness of about 1.9-2nm, irrespectively of the total thickness of the stacks. Metal-oxide-Si structures with Ru and RuO2 metal electrodes have been prepared and investigated in terms of dielectric constant, effective work function (EWF) and interfacial layer parameters. The influence of post-metallization annealing steps on these parameters was also studied. |
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ISSN: | 0169-4332 1873-5584 |
DOI: | 10.1016/j.apsusc.2011.04.062 |