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Fabrication of optical splitter and passive alignment technique with a femtosecond laser
A novel packaging process using a femtosecond laser has been developed for passive alignment of planar lightwave circuit devices. With only one step of micromachining, optical splitter and U-grooves for fiber aligning are simultaneously defined on fused silica glass. The fiber aligned optical splitt...
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Published in: | IEEE photonics technology letters 2005-11, Vol.17 (11), p.2349-2351 |
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Main Authors: | , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | A novel packaging process using a femtosecond laser has been developed for passive alignment of planar lightwave circuit devices. With only one step of micromachining, optical splitter and U-grooves for fiber aligning are simultaneously defined on fused silica glass. The fiber aligned optical splitter has a low insertion loss, less than 4 dB, including an intrinsic splitting loss of 3 dB and excess loss due to the passive alignment of a single-mode fiber. Finally, the output field pattern is presented, demonstrating the splitting ratio of the optical splitter is approximately 1 : 1. |
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ISSN: | 1041-1135 1941-0174 |
DOI: | 10.1109/LPT.2005.858101 |