A logic nanotechnology featuring strained-silicon

Strained-silicon (Si) is incorporated into a leading edge 90-nm logic technology . Strained-Si increases saturated n-type and p-type metal-oxide-semiconductor field-effect transistors (MOSFETs) drive currents by 10 and 25%, respectively. The process flow consists of selective epitaxial Si/sub 1-x/Ge...

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Bibliographic Details
Published in:IEEE electron device letters 2004-04, Vol.25 (4), p.191-193
Main Authors: Thompson, S.E., Armstrong, M., Auth, C., Cea, S., Chau, R., Glass, G., Hoffman, T., Klaus, J., Zhiyong Ma, Mcintyre, B., Murthy, A., Obradovic, B., Shifren, L., Sivakumar, S., Tyagi, S., Ghani, T., Mistry, K., Bohr, M., El-Mansy, Y.
Format: Article
Language:English
Subjects:
Capacitive sensors
Electric fields
Electron mobility
FETs
Logic
MOSFETs
Nanostructure
Nanotechnology
Semiconductor devices
Silicon
Strain
Strain control
Transistors
Uniaxial strain
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Summary:Strained-silicon (Si) is incorporated into a leading edge 90-nm logic technology . Strained-Si increases saturated n-type and p-type metal-oxide-semiconductor field-effect transistors (MOSFETs) drive currents by 10 and 25%, respectively. The process flow consists of selective epitaxial Si/sub 1-x/Ge/sub x/ in the source/drain regions to create longitudinal uniaxial compressive strain in the p-type MOSFET. A tensile Si nitride-capping layer is used to introduce tensile uniaxial strain into the n-type MOSFET and enhance electron mobility. Unlike past strained-Si work: 1) the amount of strain for the n-type and p-type MOSFET can be controlled independently on the same wafer and 2) the hole mobility enhancement in this letter is present at large vertical electric fields, thus, making this flow useful for nanoscale transistors in advanced logic technologies.
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2004.825195