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Optimized surface silylation of chemically amplified epoxidized photoresists for micromachining applications
We explored the selective wet silylation of noncrosslinked areas of epoxidized photoresists using chlorosilanes. Emphasis was placed on the Si uptake of the epoxy films when controlled low levels of water were incorporated into the silylation solution. Fourier transform infrared measurements and oxy...
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Published in: | Journal of applied polymer science 2010-08, Vol.117 (4), p.2189-2195 |
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container_title | Journal of applied polymer science |
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creator | Kontziampasis, D Beltsios, K Tegou, E Argitis, P Gogolides, E |
description | We explored the selective wet silylation of noncrosslinked areas of epoxidized photoresists using chlorosilanes. Emphasis was placed on the Si uptake of the epoxy films when controlled low levels of water were incorporated into the silylation solution. Fourier transform infrared measurements and oxygen-plasma resistance data with in situ laser interferometry and multiwavelength ellipsometry are presented. The fine tuning of the moisture level was found to be crucial for the generation of satisfactory and reproducible structures. The optimized version of the process was shown to be useful for epoxy-based dry micromachining. Overall, an attractive positive-tone process is presented as an alternative to the usual negative-tone process for commercial epoxy resists. |
doi_str_mv | 10.1002/app.31644 |
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Emphasis was placed on the Si uptake of the epoxy films when controlled low levels of water were incorporated into the silylation solution. Fourier transform infrared measurements and oxygen-plasma resistance data with in situ laser interferometry and multiwavelength ellipsometry are presented. The fine tuning of the moisture level was found to be crucial for the generation of satisfactory and reproducible structures. The optimized version of the process was shown to be useful for epoxy-based dry micromachining. Overall, an attractive positive-tone process is presented as an alternative to the usual negative-tone process for commercial epoxy resists.</description><identifier>ISSN: 0021-8995</identifier><identifier>ISSN: 1097-4628</identifier><identifier>EISSN: 1097-4628</identifier><identifier>DOI: 10.1002/app.31644</identifier><identifier>CODEN: JAPNAB</identifier><language>eng</language><publisher>Hoboken: Wiley Subscription Services, Inc., A Wiley Company</publisher><subject>Applied sciences ; Chlorosilanes ; Electronics ; Exact sciences and technology ; Fourier transforms ; functionalization of polymers ; Infrared ; Low level ; Microelectronic fabrication (materials and surfaces technology) ; Micromachining ; microstructure ; Photoresists ; selectivity ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Tuning ; Uptakes</subject><ispartof>Journal of applied polymer science, 2010-08, Vol.117 (4), p.2189-2195</ispartof><rights>Copyright © 2010 Wiley Periodicals, Inc.</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c4264-54aae79050852939e60d9828464776425f4d4495b4963fb4adb943e620e1dda93</citedby><cites>FETCH-LOGICAL-c4264-54aae79050852939e60d9828464776425f4d4495b4963fb4adb943e620e1dda93</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27903,27904</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=22914597$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Kontziampasis, D</creatorcontrib><creatorcontrib>Beltsios, K</creatorcontrib><creatorcontrib>Tegou, E</creatorcontrib><creatorcontrib>Argitis, P</creatorcontrib><creatorcontrib>Gogolides, E</creatorcontrib><title>Optimized surface silylation of chemically amplified epoxidized photoresists for micromachining applications</title><title>Journal of applied polymer science</title><addtitle>J. Appl. Polym. Sci</addtitle><description>We explored the selective wet silylation of noncrosslinked areas of epoxidized photoresists using chlorosilanes. Emphasis was placed on the Si uptake of the epoxy films when controlled low levels of water were incorporated into the silylation solution. Fourier transform infrared measurements and oxygen-plasma resistance data with in situ laser interferometry and multiwavelength ellipsometry are presented. The fine tuning of the moisture level was found to be crucial for the generation of satisfactory and reproducible structures. The optimized version of the process was shown to be useful for epoxy-based dry micromachining. Overall, an attractive positive-tone process is presented as an alternative to the usual negative-tone process for commercial epoxy resists.</description><subject>Applied sciences</subject><subject>Chlorosilanes</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Fourier transforms</subject><subject>functionalization of polymers</subject><subject>Infrared</subject><subject>Low level</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Micromachining</subject><subject>microstructure</subject><subject>Photoresists</subject><subject>selectivity</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. 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Appl. Polym. Sci</addtitle><date>2010-08-15</date><risdate>2010</risdate><volume>117</volume><issue>4</issue><spage>2189</spage><epage>2195</epage><pages>2189-2195</pages><issn>0021-8995</issn><issn>1097-4628</issn><eissn>1097-4628</eissn><coden>JAPNAB</coden><abstract>We explored the selective wet silylation of noncrosslinked areas of epoxidized photoresists using chlorosilanes. Emphasis was placed on the Si uptake of the epoxy films when controlled low levels of water were incorporated into the silylation solution. Fourier transform infrared measurements and oxygen-plasma resistance data with in situ laser interferometry and multiwavelength ellipsometry are presented. The fine tuning of the moisture level was found to be crucial for the generation of satisfactory and reproducible structures. The optimized version of the process was shown to be useful for epoxy-based dry micromachining. 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subjects | Applied sciences Chlorosilanes Electronics Exact sciences and technology Fourier transforms functionalization of polymers Infrared Low level Microelectronic fabrication (materials and surfaces technology) Micromachining microstructure Photoresists selectivity Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Tuning Uptakes |
title | Optimized surface silylation of chemically amplified epoxidized photoresists for micromachining applications |
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