A NOVEL FORMULA FOR EFFECTIVE THERMAL CONDUCTIVITY OF VAPOR CHAMBER

In recent years, power dissipation per chip is projected to reach the range of 100-200 W for high-performance application in electronic devices. The development of cooling technique related to the application of two-phase flow in heat transfer assembly to thermal modules has become mature, and heat...

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Bibliographic Details
Published in:Experimental techniques (Westport, Conn.) Conn.), 2011-09, Vol.35 (5), p.35-40
Main Authors: Wang, J.-C., Wang, R.-T.
Format: Article
Language:English
Subjects:
Characterization and Evaluation of Materials
Chemistry and Materials Science
Cooling
Design of experiments
Experiments
Heat conductivity
Materials Science
Techniques
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Summary:In recent years, power dissipation per chip is projected to reach the range of 100-200 W for high-performance application in electronic devices. The development of cooling technique related to the application of two-phase flow in heat transfer assembly to thermal modules has become mature, and heat pipe-based thermal modules are one of the best choices. Here, Wang and Wang derive a novel formula for the effective thermal conductivity of a vapor chamber and rapidly compute its value when applied in simulations of the vapor chamber-based thermal module. This formula is dependent on the characteristics of the vapor chamber and input power and dimensions of heat source.
ISSN:0732-8818
1747-1567
DOI:10.1111/j.1747-1567.2010.00652.x