Study on properties of a novel photosensitive polysiloxane urethane acrylate for solder mask

The photosensitive and physical and mechanical properties of a novel polysiloxane urethane acrylate (PSUA) for solder mask were investigated using real-time FTIR, DMTA and TGA. It is noted that PSUA showed a notable photosensitivity and a good compatibility with the acrylic monomers and resins. PSUA...

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Bibliographic Details
Published in:Journal of applied polymer science 2010-06, Vol.116 (5), p.3035-3039
Main Authors: Sun, Fang, Jiang, Shengling
Format: Article
Language:English
Subjects:
Acrylates
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Masks
Physicochemistry of polymers
Polymerization
Polymers
Polymers and radiations
polysiloxane
Polysiloxanes
Reproduction
Resins
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
solder mask
Solders
Thermal properties
urethane acrylate
Urethanes
UV curing
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Summary:The photosensitive and physical and mechanical properties of a novel polysiloxane urethane acrylate (PSUA) for solder mask were investigated using real-time FTIR, DMTA and TGA. It is noted that PSUA showed a notable photosensitivity and a good compatibility with the acrylic monomers and resins. PSUA cured film exhibited excellent thermal property, tensile strength and toughness, and chemical resistance. The decomposition temperature of PSUA was 402 °C. Thermal weight losses of pure PSUA cured film at 300 °C were only 5%. Elongation percentage of PSUA cured film was up to 59%. PSUA resin can be used for solder mask materials for printed circuit. Technology performances of photosensitive imaging flexible solder mask containing PSUA answers operating requirements of the solder masker for printing circuit board.
ISSN:0021-8995
1097-4628
1097-4628
DOI:10.1002/app.31847