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Polycarbonate surface cell's adhesion examination after Nd:YAG laser irradiation

Nd:YAG laser treatment was used in order to increase surface cell adhesion aspects of polycarbonate (PC) films prepared via melt process. The treatment was carried out under different wavelengths and beam diameters. ATR-FTIR and UV spectra obtained from different samples before and after laser treat...

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Bibliographic Details
Published in:Materials Science & Engineering C 2009-05, Vol.29 (4), p.1491-1497
Main Authors: Ramazani S.A., Ahmad, Mousavi, Seyyed Abbas, Seyedjafari, Ehsan, Poursalehi, Reza, Sareh, Shohreh, Silakhori, Kaveh, Poorfatollah, Ali Akbar, Shamkhali, Amir Nasser
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Language:English
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Summary:Nd:YAG laser treatment was used in order to increase surface cell adhesion aspects of polycarbonate (PC) films prepared via melt process. The treatment was carried out under different wavelengths and beam diameters. ATR-FTIR and UV spectra obtained from different samples before and after laser treatment in air showed that laser irradiation has induced some chemical and physical changes in surface properties. The irradiated films were also characterized using scanning electron microscopy (SEM) and contact angle measurements. Effect of pulse numbers on the surface properties was also investigated. Cell culture test was used to evaluate cell adhesion property on the PC films before and after treatment. The results obtained from this test showed that after laser treatment, the cells were attached and proliferated extensively on the Nd:YAG laser treated films in comparison with the unmodified PC. Moreover, it was revealed that a decrease in the laser beam diameter and an increase in the irradiated pulse numbers increased surface wettability and caused a better cell attachment on the polymer surface. The obtained results also showed that a decrease in the laser beam diameter and an increase in the irradiated pulse numbers increased surface wettability and caused a better cell attachment on the polymer surface.
ISSN:0928-4931
1873-0191
DOI:10.1016/j.msec.2008.11.019