Spatially and temporally resolved thermal imaging of cyclically heated interconnects by use of scanning thermal microscopy

A scanning thermal microscope with a Wollaston probe was used to investigate the spatial distribution and temporal variation of temperature in interconnect structures subjected to thermal cycling. The probe, utilized in passive temperature sensing mode, was calibrated from 20°C to 200°C using a sing...

Full description

Saved in:
Bibliographic Details
Published in:Microscopy research and technique 2008-08, Vol.71 (8), p.579-584
Main Authors: Barbosa III, Nicholas, Slifka, Andrew J.
Format: Article
Language:English
Subjects:
calibration
cyclic joule heating
interconnect
scanning thermal microscope
SThM
temperature distribution
temporal
thermal cycling
Wollaston probe
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:A scanning thermal microscope with a Wollaston probe was used to investigate the spatial distribution and temporal variation of temperature in interconnect structures subjected to thermal cycling. The probe, utilized in passive temperature sensing mode, was calibrated from 20°C to 200°C using a single‐layer aluminum microdevice. Spatial measurements were performed on nonpassivated aluminum interconnects sinusoidally heated by a 6 MA/cm2 current at 200 Hz. The interconnects were determined to have temperatures that decreased with position from a maximum located at the center of both the interconnect length and width. Time‐resolved temperature measurements were performed on the same structures sinusoidally heated by a 6 MA/cm2 current at 2 Hz. Both the peak‐cycle temperature and average‐cycle temperature were found to decrease with increasing distance from the center of the width of the interconnects. Microsc. Res. Tech., 2008. Published 2008 Wiley‐Liss, Inc.
ISSN:1059-910X
1097-0029
DOI:10.1002/jemt.20589