Extraction of Sheet Resistance and Line Width From All-Copper ECD Test Structures Fabricated From Silicon Preforms

Test structures have been fabricated to allow electrical critical dimensions (ECD) to be extracted from copper features with dimensions comparable to those replicated in integrated circuit (IC) interconnect systems. The implementation of these structures is such that no conductive barrier metal has...

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Bibliographic Details
Published in:IEEE transactions on semiconductor manufacturing 2008-11, Vol.21 (4), p.495-503
Main Authors: Shulver, B.J.R., Bunting, A.S., Gundlach, A.M., Haworth, L.I., Ross, A., Smith, S., Snell, A.J., Stevenson, J., Walton, A.J., Allen, R., Cresswell, M.W.
Format: Article
Language:English
Subjects:
Applied sciences
Barriers
Circuit testing
CONNECTORS (ELECTRICAL)
Copper
critical dimension (CD)
Design engineering
Design. Technologies. Operation analysis. Testing
Electric resistance
Electric variables measurement
ELECTRICAL CONDUCTIVITY
electrical critical dimension (ECD)
Electrical resistivity
electrical test structure
Electronics
Exact sciences and technology
Extraction
EXTRACTIVE METALLURGY
FABRICATION
Feature extraction
Integrated circuit interconnections
Integrated circuit testing
Integrated circuits
line width
metrology
Preforms
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
SEMICONDUCTORS
Silicon
System testing
Testing, measurement, noise and reliability
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Description
Summary:Test structures have been fabricated to allow electrical critical dimensions (ECD) to be extracted from copper features with dimensions comparable to those replicated in integrated circuit (IC) interconnect systems. The implementation of these structures is such that no conductive barrier metal has been used. The advantage of this approach is that the electrical measurements provide a nondestructive and efficient method for determining critical dimension (CD) values and for enabling fundamental studies of electron transport in narrow copper features unaffected by the complications of barrier metal films. This paper reports on the results of tests which have been conducted to evaluate various extraction methods for sheet resistance and line width values from the current design.
ISSN:0894-6507
1558-2345
DOI:10.1109/TSM.2008.2004312