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Interfacial reactions between eutectic Sn–Pb solder and Co substrate
This study examined the reaction couples of Co substrate with liquid and solid Sn-37 wt% Pb alloys, respectively. In the liquid/solid Sn–Pb/Co couples, one single-phase CoSn 3 layer was found at the interface at temperatures from 210 to 250 °C. The layer thickness was measured as a function of the r...
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| Published in: | Journal of materials science 2011-04, Vol.46 (8), p.2654-2661 |
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| Main Authors: | , |
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| Language: | English |
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| cites | cdi_FETCH-LOGICAL-c421t-30efcc0fdafc8e0f705aa9fa26cfd639dbc7588804572c0f307454036fe7573c3 |
| container_end_page | 2661 |
| container_issue | 8 |
| container_start_page | 2654 |
| container_title | Journal of materials science |
| container_volume | 46 |
| creator | Wang, Chao-hong Kuo, Chun-yi |
| description | This study examined the reaction couples of Co substrate with liquid and solid Sn-37 wt% Pb alloys, respectively. In the liquid/solid Sn–Pb/Co couples, one single-phase CoSn
3
layer was found at the interface at temperatures from 210 to 250 °C. The layer thickness was measured as a function of the reaction time. The layer growth rate increased with increasing temperature. The CoSn
3
layer growth was linear in the early stage and then became parabolic. In addition, the similar CoSn
3
growth behavior results were observed in the solid/solid Sn–Pb/Co couples from 150 to 170 °C. Nevertheless, one Pb-rich phase layer accumulated at the solder/CoSn
3
interface due to Sn consumption. Also, the reaction kinetics of Sn-37 wt% Pb/Co was symmetrically studied at various temperatures. The chemical reaction constants, diffusion constants, and the relevant activation energies were reported. |
| doi_str_mv | 10.1007/s10853-010-5121-0 |
| format | article |
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3
layer was found at the interface at temperatures from 210 to 250 °C. The layer thickness was measured as a function of the reaction time. The layer growth rate increased with increasing temperature. The CoSn
3
layer growth was linear in the early stage and then became parabolic. In addition, the similar CoSn
3
growth behavior results were observed in the solid/solid Sn–Pb/Co couples from 150 to 170 °C. Nevertheless, one Pb-rich phase layer accumulated at the solder/CoSn
3
interface due to Sn consumption. Also, the reaction kinetics of Sn-37 wt% Pb/Co was symmetrically studied at various temperatures. The chemical reaction constants, diffusion constants, and the relevant activation energies were reported.</description><identifier>ISSN: 0022-2461</identifier><identifier>EISSN: 1573-4803</identifier><identifier>DOI: 10.1007/s10853-010-5121-0</identifier><language>eng</language><publisher>Boston: Springer US</publisher><subject>Activation energy ; Alloys ; Characterization and Evaluation of Materials ; Chemical reaction, Rate of ; Chemical reactions ; Chemistry and Materials Science ; Classical Mechanics ; Constants ; Crystallography and Scattering Methods ; Eutectic reactions ; Interface reactions ; Lead ; Materials Science ; Organic chemistry ; Polymer Sciences ; Reaction kinetics ; Reaction time ; Solid Mechanics ; Substrates ; Thickness measurement</subject><ispartof>Journal of materials science, 2011-04, Vol.46 (8), p.2654-2661</ispartof><rights>Springer Science+Business Media, LLC 2010</rights><rights>COPYRIGHT 2011 Springer</rights><rights>Journal of Materials Science is a copyright of Springer, (2010). All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c421t-30efcc0fdafc8e0f705aa9fa26cfd639dbc7588804572c0f307454036fe7573c3</citedby><cites>FETCH-LOGICAL-c421t-30efcc0fdafc8e0f705aa9fa26cfd639dbc7588804572c0f307454036fe7573c3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Wang, Chao-hong</creatorcontrib><creatorcontrib>Kuo, Chun-yi</creatorcontrib><title>Interfacial reactions between eutectic Sn–Pb solder and Co substrate</title><title>Journal of materials science</title><addtitle>J Mater Sci</addtitle><description>This study examined the reaction couples of Co substrate with liquid and solid Sn-37 wt% Pb alloys, respectively. In the liquid/solid Sn–Pb/Co couples, one single-phase CoSn
3
layer was found at the interface at temperatures from 210 to 250 °C. The layer thickness was measured as a function of the reaction time. The layer growth rate increased with increasing temperature. The CoSn
3
layer growth was linear in the early stage and then became parabolic. In addition, the similar CoSn
3
growth behavior results were observed in the solid/solid Sn–Pb/Co couples from 150 to 170 °C. Nevertheless, one Pb-rich phase layer accumulated at the solder/CoSn
3
interface due to Sn consumption. Also, the reaction kinetics of Sn-37 wt% Pb/Co was symmetrically studied at various temperatures. The chemical reaction constants, diffusion constants, and the relevant activation energies were reported.</description><subject>Activation energy</subject><subject>Alloys</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemical reaction, Rate of</subject><subject>Chemical reactions</subject><subject>Chemistry and Materials Science</subject><subject>Classical Mechanics</subject><subject>Constants</subject><subject>Crystallography and Scattering Methods</subject><subject>Eutectic reactions</subject><subject>Interface reactions</subject><subject>Lead</subject><subject>Materials Science</subject><subject>Organic chemistry</subject><subject>Polymer Sciences</subject><subject>Reaction kinetics</subject><subject>Reaction time</subject><subject>Solid Mechanics</subject><subject>Substrates</subject><subject>Thickness measurement</subject><issn>0022-2461</issn><issn>1573-4803</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><recordid>eNp1kcFq3DAQhkVpodu0D9CboYfQg5MZybLsY1iaZiHQ0LRnoZVHi4NXSiSZtLe-Q98wTxItDoQUimAEw_cP_8_P2EeEEwRQpwmhk6IGhFoixxpesRVKJeqmA_GarQA4r3nT4lv2LqUbAJCK44qdb3ym6IwdzVRFMjaPwadqS_meyFc0ZyorW137hz9_r7ZVCtNAsTJ-qNahSvM25WgyvWdvnJkSfXj6j9jP8y8_1hf15bevm_XZZW0bjrkWQM5acINxtiNwCqQxvTO8tW5oRT9srZJd10FT3BVOgGpkA6J1pEoYK47Y8XL3Noa7mVLW-zFZmibjKcxJ96B60UqEQn76h7wJc_TFnOZc9iU8tqpQJwu1MxPp0btQ4tjyBtqPNnhyY9mfNYiNwjKL4PMLQWEy_co7M6ekN9ffX7K4sDaGlCI5fRvHvYm_NYI-tKaX1nRpTR9a0wfbfNGkwvodxWfb_xc9Ap0MmHw</recordid><startdate>20110401</startdate><enddate>20110401</enddate><creator>Wang, Chao-hong</creator><creator>Kuo, Chun-yi</creator><general>Springer US</general><general>Springer</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>ISR</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M7S</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PTHSS</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20110401</creationdate><title>Interfacial reactions between eutectic Sn–Pb solder and Co substrate</title><author>Wang, Chao-hong ; Kuo, Chun-yi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c421t-30efcc0fdafc8e0f705aa9fa26cfd639dbc7588804572c0f307454036fe7573c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2011</creationdate><topic>Activation energy</topic><topic>Alloys</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemical reaction, Rate of</topic><topic>Chemical reactions</topic><topic>Chemistry and Materials Science</topic><topic>Classical Mechanics</topic><topic>Constants</topic><topic>Crystallography and Scattering Methods</topic><topic>Eutectic reactions</topic><topic>Interface reactions</topic><topic>Lead</topic><topic>Materials Science</topic><topic>Organic chemistry</topic><topic>Polymer Sciences</topic><topic>Reaction kinetics</topic><topic>Reaction time</topic><topic>Solid Mechanics</topic><topic>Substrates</topic><topic>Thickness measurement</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wang, Chao-hong</creatorcontrib><creatorcontrib>Kuo, Chun-yi</creatorcontrib><collection>CrossRef</collection><collection>Science In Context</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Engineering Database</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>Engineering Collection</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of materials science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wang, Chao-hong</au><au>Kuo, Chun-yi</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Interfacial reactions between eutectic Sn–Pb solder and Co substrate</atitle><jtitle>Journal of materials science</jtitle><stitle>J Mater Sci</stitle><date>2011-04-01</date><risdate>2011</risdate><volume>46</volume><issue>8</issue><spage>2654</spage><epage>2661</epage><pages>2654-2661</pages><issn>0022-2461</issn><eissn>1573-4803</eissn><abstract>This study examined the reaction couples of Co substrate with liquid and solid Sn-37 wt% Pb alloys, respectively. In the liquid/solid Sn–Pb/Co couples, one single-phase CoSn
3
layer was found at the interface at temperatures from 210 to 250 °C. The layer thickness was measured as a function of the reaction time. The layer growth rate increased with increasing temperature. The CoSn
3
layer growth was linear in the early stage and then became parabolic. In addition, the similar CoSn
3
growth behavior results were observed in the solid/solid Sn–Pb/Co couples from 150 to 170 °C. Nevertheless, one Pb-rich phase layer accumulated at the solder/CoSn
3
interface due to Sn consumption. Also, the reaction kinetics of Sn-37 wt% Pb/Co was symmetrically studied at various temperatures. The chemical reaction constants, diffusion constants, and the relevant activation energies were reported.</abstract><cop>Boston</cop><pub>Springer US</pub><doi>10.1007/s10853-010-5121-0</doi><tpages>8</tpages></addata></record> |
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| ispartof | Journal of materials science, 2011-04, Vol.46 (8), p.2654-2661 |
| issn | 0022-2461 1573-4803 |
| language | eng |
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| source | Springer Nature |
| subjects | Activation energy Alloys Characterization and Evaluation of Materials Chemical reaction, Rate of Chemical reactions Chemistry and Materials Science Classical Mechanics Constants Crystallography and Scattering Methods Eutectic reactions Interface reactions Lead Materials Science Organic chemistry Polymer Sciences Reaction kinetics Reaction time Solid Mechanics Substrates Thickness measurement |
| title | Interfacial reactions between eutectic Sn–Pb solder and Co substrate |
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