Manufacturing and Macroscopic Properties of Cold Sprayed Cu-In Coating Material for Sputtering Target

• Published in: Journal of thermal spray technology 2011-03, Vol.20 (3), p.497-507
• Main Authors: Jin, Young-Min, Cho, Jin-Hyeon, Park, Dong-Yong, Kim, Ju-Ho, Lee, Kee-Ahn
• Format: Article
• Language: English
• Subjects: Analytical Chemistry; Annealing; ANNEALING PROCESSES; Applied sciences; Characterization and Evaluation of Materials; Chemistry and Materials Science; Coating; COATINGS; Copper; Corrosion and Coatings; Exact sciences and technology; Hardness; HEAT TREATING; Heat treatment; Machines; MANUFACTURE; Manufacturing; Materials Science; Metals. Metallurgy; Microstructure; MICROSTRUCTURES; Peer Reviewed; Porosity; Processes; Production techniques; SPRAYING; Sprays; SPUTTERING; Surface treatment; Surfaces and Interfaces; Thin Films; Tribology
• ISSN: 1059-9630; 1544-1016
• DOI: 10.1007/s11666-010-9552-6

This study attempted to manufacture a Cu-In coating layer via the cold spray process and to investigate the applicability of the layer as a sputtering target material. In addition, changes made to the microstructure and properties of the layer due to annealing heat treatment were evaluated, compared, and analyzed. To examine the microstructural and property changes made to the Cu-In coating layer and Cu coating layer (comparison material), ICP, XRD, SEM, and other tests were conducted; purity, density, hardness, porosity, and bond-strength were measured. The results showed that coating layers with thickness of 20 mm (Cu) and 810 μm (Cu-In) could be manufactured via cold spraying under optimal process conditions. With the Cu-In coating layer, the pure Cu and intermetallic compounds of Cu 7 In 3 and CuIn 4 were found to exist inside the layer regardless of annealing heat treatment. The preannealing inconsistent microstructure of the layer, whose phases were difficult to distinguish was found to have transformed into one with clearer phase distinction and fine, consistent grains following thermal treatment via a progress of recovery, recrystallization, and grain growth. The porosity and hardness values of the coating layers were 1.4% and 133.9 HV, respectively, for Cu and 3.54% and 476.6 HV, respectively, for Cu-In. The values of the Cu-In layer were higher than those of the Cu layer in terms of porosity and hardness, which declined drastically after annealing. With the porosity of the Cu-In coating layer in particular, the higher value found during the preannealing stage dropped to 0.36% after heat treatment of 773 K/1 h as the level on a par with pure Cu (0.44%), thus indicating the improved quality of the Cu-In layer. Moreover, the results of the bond-strength measurement performed on the Cu-In coating layer and annealing treated materials revealed the strength to be relatively high for heat treated coating layers. Based on the findings of this study and on the comparison and discussion of the properties that are typically required of the target material, the Cu-In coating layer manufactured via cold spray process and annealing heat treatment can be said to be applicable as sputtering target in the future.