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PMMA-SiO2 organic–inorganic hybrid films: determination of dielectric characteristics
Organic–inorganic hybrid thin films have been prepared by a modified sol–gel route using tetraethyl orthosilicate as the inorganic (silica) source, methyl methacrylate (MMA) as the organic source, and 3-trimetoxysilylpropyl methacrylate as the coupling agent. The films were prepared by spin coating...
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Published in: | Journal of sol-gel science and technology 2011-04, Vol.58 (1), p.218-224 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Organic–inorganic hybrid thin films have been prepared by a modified sol–gel route using tetraethyl orthosilicate as the inorganic (silica) source, methyl methacrylate (MMA) as the organic source, and 3-trimetoxysilylpropyl methacrylate as the coupling agent. The films were prepared by spin coating on Si (100) p-type substrates and subsequently heat-treated at 90 °C. Fourier transform infrared results reveal a set of absorption bands associated with the formation of both PMMA and SiO
2
phases in the hybrid films. Capacitance–voltage (
C
–
V
) characterization was carried out on metal-insulator-metal (MIM) and metal-insulator-semiconductor (MIS) structures, with the hybrid films as the insulator layer to evaluate the electrical properties. We present a detailed comparative analysis of the dielectric constant obtained from
C
–
V
characterization in the frequency range of 1 kHz–1 MHz. For the PMMA-SiO
2
hybrid material the dielectric constant values obtained were around 9.5 at 1 MHz which is superior to the values reported for thermally grown SiO
2
and pure PMMA materials. The interface state density for PMMA-SiO
2
on Si was approximately 10
10
cm
−2
, which is comparable to the standard SiO
2
/Si structures. Due to the electrical behavior and low processing temperatures this hybrid dielectric is a very promising candidate for flexible electronic devices and its subsequent implementation does not require complex equipment. |
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ISSN: | 0928-0707 1573-4846 |
DOI: | 10.1007/s10971-010-2380-9 |