Microsystem optoelectronic integration for mixed multisignal systems

The integration and packaging of optoelectronic devices with electronic circuits and systems has growing application in many fields, ranging from long to micro haul links. An exploration of the opportunities, integration technologies, and some recent results using thin-film device heterogeneous inte...

Full description

Saved in:
Bibliographic Details
Published in:IEEE journal of selected topics in quantum electronics 2000-11, Vol.6 (6), p.1231-1239
Main Authors: Jokerst, N.M., Brooke, M.A., Laskar, J., Wills, D.S., Brown, A.S., Vrazel, M., Jung, S., Joo, Y., Chang, J.J.
Format: Article
Language:English
Subjects:
Arrays
CMOS technology
Electronic circuits
Electronics packaging
Focal plane
Gallium arsenide
Interconnections
Links
Optical arrays
Optoelectronic devices
Optoelectronics
Pixels
Semiconductor thin films
Smart pixels
Thin film circuits
Thin film devices
Very large scale integration
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The integration and packaging of optoelectronic devices with electronic circuits and systems has growing application in many fields, ranging from long to micro haul links. An exploration of the opportunities, integration technologies, and some recent results using thin-film device heterogeneous integration with Si CMOS VLSI and GaAs MESFET circuit technologies are presented. Applications explored include alignment tolerant optoelectronic links for network interconnections, smart pixel focal plane array processing through the integration of imaging arrays with sigma delta analog to digital converters underneath each pixel, and three-dimensional computational systems using vertical through-Si optical interconnections.
ISSN:1077-260X
1558-4542
DOI:10.1109/2944.902172