Issues related to the implementation of Pb-free electronic solders in consumer electronics

• Published in: Journal of materials science. Materials in electronics 2007-03, Vol.18 (1-3), p.319-330
• Main Author: Frear, DR
• Format: Article
• Language: English
• Subjects: Alloys; Assembly; Electromigration; Electronics; Fatigue (materials); Lead base alloys; Packages; R&D; Research & development; Solders; Tin base alloys
• ISSN: 0957-4522; 1573-482X
• DOI: 10.1007/s10854-006-9021-7

Consumer electronic applications are the primary target of the Pb-free initiative and package assembly and performance is affected by the move from eutectic Sn-Pb to Pb-free solder alloys. This paper outlines the key issues and mitigation possibilities for package assembly using Pb-free solders: High temperature reflow, Interfacial reactions, and Reliability. At the high temperatures required to reflow Pb-free alloys, moisture absorbed into the package can result in delamination and failure. The reaction of the Pb-free solder with Ni and Cu metallizations results in interfacial intermetallics that are not significantly thicker than with Sn-Pb but provide a path for fracture under mechanical loading due to the increased strength of the Pb-free alloys. The reliability issues discussed include thermomechanical fatigue, mechanical shock, electromigration and whiskering. The Pb-free alloys tend to improve thermomechanical fatigue and electromigration performance but are detrimental to mechanical shock and whiskering. Design trade-offs must be made to successfully implement Pb-free alloys into consumer applications.