Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder

Effects of Pr addition on wettability, microstructure of Sn3.8Ag0.7Cu solder were studied, the mechanical properties of solder joints were investigated and the fracture morphologies were also analyzed in this paper. The results indicate that adding appropriate amount of Pr can evidently improve the...

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Bibliographic Details
Published in:Journal of materials science. Materials in electronics 2010-09, Vol.21 (9), p.910-916
Main Authors: Gao, Lili, Xue, Songbai, Zhang, Liang, Xiao, Zhengxiang, Dai, Wei, Ji, Feng, Ye, Huan, Zeng, Guang
Format: Article
Language:English
Subjects:
Characterization and Evaluation of Materials
Chemistry and Materials Science
Dendritic structure
Electronics
Fracture mechanics
Materials Science
Mechanical properties
Microstructure
Nucleation
Optical and Electronic Materials
Solders
Wettability
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Summary:Effects of Pr addition on wettability, microstructure of Sn3.8Ag0.7Cu solder were studied, the mechanical properties of solder joints were investigated and the fracture morphologies were also analyzed in this paper. The results indicate that adding appropriate amount of Pr can evidently improve the wettability of solder, and it is also found that Pr can refine the β-Sn dendrites and reduce the intermetallic compounds growth inside the solder due to the fine PrSn 3 particles formed in the solder which can act as heterogeneous nucleation sites. Moreover, the joints soldered with the SnAgCuPr solders possess sound mechanical properties which may result from the finer microstructure improved by the Pr.
ISSN:0957-4522
1573-482X
DOI:10.1007/s10854-009-0017-y