Packaging using microelectromechanical technologies and planar components

A novel millimeter-wave packaging structure was developed in which a micromachined low-loss planar component and flip-chip devices were integrated on a silicon substrate. A low-loss planar filter was achieved on a 7-mm-square silicon substrate employing an inverted microstrip line and a unique reson...

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Bibliographic Details
Published in:IEEE transactions on microwave theory and techniques 2001-11, Vol.49 (11), p.2099-2104
Main Authors: Takahashi, K., Sangawa, U., Fujita, S., Matsuo, M., Urabe, T., Ogura, H., Yabuki, H.
Format: Article
Language:English
Subjects:
Antennas
Attenuation
Bonding
Fabrication
K-band
Micromachining
Micromechanics
Microstrip filters
Microstrip resonators
Microwaves
Millimeter wave technology
Packaging
Resonator filters
Silicon
Silicon substrates
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Summary:A novel millimeter-wave packaging structure was developed in which a micromachined low-loss planar component and flip-chip devices were integrated on a silicon substrate. A low-loss planar filter was achieved on a 7-mm-square silicon substrate employing an inverted microstrip line and a unique resonator. High attenuation in the stopband was also obtained by introducing a pole control technique. Fabrication of a compact K-band receiver front-end incorporating a built-in filter was realized using multilayered benzocyclobutene (BCB) and flip-chip bonding techniques. Furthermore, we propose an alternative BCB suspended structure and demonstrate a planar antenna for Ka-band applications. These technologies bring to reality high-performance compact packaged systems in millimeter-wave region applications.
ISSN:0018-9480
1557-9670
DOI:10.1109/22.963143