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Crack formation in MLCCs depending on position with and without post-heat treatment
Issue Title: Special Issue: ICE-2005 International Conference on Electroceramics The crack formation behavior and mechanical properties, hardness (H), modulus (E), and fracture toughness (K ^sub IC^), at each plane of BaTiO^sub 3^ based multilayer ceramic capacitors (MLCCs) have been investigated an...
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Published in: | Journal of electroceramics 2006-12, Vol.17 (2-4), p.381-385 |
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Main Authors: | , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Issue Title: Special Issue: ICE-2005 International Conference on Electroceramics The crack formation behavior and mechanical properties, hardness (H), modulus (E), and fracture toughness (K ^sub IC^), at each plane of BaTiO^sub 3^ based multilayer ceramic capacitors (MLCCs) have been investigated and estimated using a nanoindentation technique, including effects of the post-heat treatment and the external electrode on the crack formation and mechanical properties. The crack length in each plane, length (x plane) and width (y plane) planes, has been measured for MLCCs with and without the post-heat treatment, as a function of the distance from the internal electrode. H and E values are 11.5-12.0 GPa and 175-190 GPa, respectively, independent of the plane and the post-heat treatment. The crack length in the x plane is smaller than that in the y plane, which is gradually increased as the indentation position is far away from the internal electrode. The external electrode affects the crack formation in regions near to the internal electrode, showing small crack length till 20 μm from the internal electrode. K ^sub IC^ values in the x plane are larger than those in the y plane. The external electrode affects only the K ^sub IC^ values in the x plane within the error range, without effect of the post-heat treatment.[PUBLICATION ABSTRACT] |
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ISSN: | 1385-3449 1573-8663 |
DOI: | 10.1007/s10832-006-9636-3 |