Estimation of liquidus temperature of Sn-based alloys and its application to the design of Pb-free solder

An interesting relation between the melting temperature and the alloy composition was discovered in Sn-based alloys through the evaluation of a series of experimental data on the liquidus temperatures (LTs) for 134 types of multi-component Sn alloys. In these Sn alloys, the degree of liquidus temper...

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Bibliographic Details
Published in:Journal of materials science. Materials in electronics 2002-05, Vol.13 (5), p.269-272
Main Authors: EZAKI, H, NAMBU, T, NINOMIYA, R, NAKAHARA, Y, WANG, C. Q, MORINAGA, M
Format: Article
Language:English
Subjects:
Alloying
Alloying elements
Alloys
Applied sciences
Brazing. Soldering
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Joining, thermal cutting: metallurgical aspects
Lead base alloys
Liquidus
Mathematical analysis
Metals. Metallurgy
Solders
Temperature
Tin base alloys
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Summary:An interesting relation between the melting temperature and the alloy composition was discovered in Sn-based alloys through the evaluation of a series of experimental data on the liquidus temperatures (LTs) for 134 types of multi-component Sn alloys. In these Sn alloys, the degree of liquidus temperature drop with alloying was not affected by the kind of individual elements but by their total atomic fraction alone. The compositional dependence on the LT could be expressed by the equation, LT(K)=499.79-1.799X, where X was the total mole percentage of alloying elements. It was demonstrated that the use of this equation would make it possible to develop Pb-free solder alloys more efficiently.[PUBLICATION ABSTRACT]
ISSN:0957-4522
1573-482X
DOI:10.1023/A:1015555505709