Comparison of IGBT short-circuit failure “ohmic mode”: Epoxy molded package versus silicone gel module for new fail-safe and interruptible power converters

An epoxy molded package is compared with a silicone gel module with IGBTs chips in short-circuit failure modes with respect to critical energy, I2Tmelting and explosion energy capabilities. Special importance was attached to “ohmic mode” assessment and ageing of the failed chips. The molded technolo...

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Bibliographic Details
Published in:Microelectronics and reliability 2011-09, Vol.51 (9-11), p.1919-1926
Main Authors: Richardeau, Frédéric, Dou, Zhifeng, Sarraute, Emmanuel, Blaquiere, Jean-Marc, Flumian, Didier
Format: Article
Language:English
Subjects:
Applied sciences
Assessments
Chips
Circuit properties
Design. Technologies. Operation analysis. Testing
Electric, optical and optoelectronic circuits
Electronic circuits
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Failure
Integrated circuits
Modules
Ohmic
Other multijunction devices. Power transistors. Thyristors
Packages
Pits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Signal convertors
Silicones
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Description
Summary:An epoxy molded package is compared with a silicone gel module with IGBTs chips in short-circuit failure modes with respect to critical energy, I2Tmelting and explosion energy capabilities. Special importance was attached to “ohmic mode” assessment and ageing of the failed chips. The molded technology yields a very low and stable Rsc (1000h) also exhibit an acceptable drift of the Rsc property (
ISSN:0026-2714
1872-941X
DOI:10.1016/j.microrel.2011.07.031