Mesoscopic nonequilibrium thermodynamics treatment of the grain boundary thermal grooving induced by the anisotropic surface drift diffusion

A systematic study based on the self-consistent dynamical simulations is presented for the grain boundary thermal grooving problem by strictly following the irreversible thermodynamic theory of surfaces and interfaces with singularities [T. O. Ogurtani, J. Chem. Phys. 124, 144706 (2006)]. This appro...

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Bibliographic Details
Published in:Journal of materials science 2011-09, Vol.46 (18), p.6054-6064
Main Authors: Akyildiz, Oncu, Oren, Ersin Emre, Ogurtani, Tarik Omer
Format: Article
Language:English
Subjects:
Analysis
Anisotropy
Characterization and Evaluation of Materials
Chemistry and Materials Science
Classical Mechanics
Crystallography and Scattering Methods
Diffusion
Diffusivity
Grain boundaries
Grooving
Materials Science
Nonequilibrium thermodynamics
Polymer Sciences
Simulation
Singularities
Solid Mechanics
Thermodynamics
Tungsten
Wetting
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Summary:A systematic study based on the self-consistent dynamical simulations is presented for the grain boundary thermal grooving problem by strictly following the irreversible thermodynamic theory of surfaces and interfaces with singularities [T. O. Ogurtani, J. Chem. Phys. 124, 144706 (2006)]. This approach furnishes us to have auto-control on the otherwise free-motion of the grain boundary triple junction without presuming any equilibrium dihedral (wetting) angles at the edges. The effects of physicochemical properties and the anisotropic surface diffusivity on the transient grooving behavior, which takes place at the early stage of the scenario, were considered. We analyzed the experimental thermal grooving data reported for tungsten in the literature, and compared them with the carried simulation results. This investigation showed that the observed changes in the dihedral angles are strictly connected to the transient behavior of the simulated global system, and manifest themselves at the early stage of the thermal grooving phenomenon.
ISSN:0022-2461
1573-4803
DOI:10.1007/s10853-011-5567-8