Fabrication and experimental demonstration of the first 160 Gb/s hybrid silicon-on-insulator integrated all-optical wavelength converter

We present a hybrid integrated photonic circuit on a silicon-on-insulator substrate that performs ultra high-speed all-optical wavelength conversion. The chip incorporates a 1.25 mm non-linear SOA mounted on the SOI board using gold-tin bumps as small as 14 μm. Τhe device performs chirp filtering an...

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Bibliographic Details
Published in:Optics express 2012-02, Vol.20 (4), p.3825-3831
Main Authors: Stamatiadis, C, Stampoulidis, L, Kalavrouziotis, D, Lazarou, I, Vyrsokinos, K, Zimmermann, L, Voigt, K, Preve, G B, Moerl, L, Kreissl, J, Avramopoulos, H
Format: Article
Language:English
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Summary:We present a hybrid integrated photonic circuit on a silicon-on-insulator substrate that performs ultra high-speed all-optical wavelength conversion. The chip incorporates a 1.25 mm non-linear SOA mounted on the SOI board using gold-tin bumps as small as 14 μm. Τhe device performs chirp filtering and signal polarity inversion with two multi-mode interference (MMI) - based cascaded delay interferometers (DIs) monolithically integrated on the same SOI substrate. Full free spectral range (FSR) tuning of the DIs is accomplished by two independently tuneable on-chip thermal heaters. We demonstrate 160Gb/s all-optical wavelength conversion with power penalties of less than 4.6dB.
ISSN:1094-4087
1094-4087
DOI:10.1364/OE.20.003825