Investigation of Interface Microstructure of Diamond and Ti Coated Diamond Brazed with Cu-Sn-Ti Alloy

Cu-Sn-Ti brazing alloys are gaining importance as active brazing alloys for brazing diamond tools. The microstructure at the interface between diamond or Ti-coated diamond grits and Cu-Sn-Ti brazing alloy and bonding strength have been investigated in this paper. The results show that TiC layer form...

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Bibliographic Details
Published in:Key engineering materials 2011-01, Vol.487, p.199-203
Main Authors: Chen, Yan, Fu, Yu Can, Su, Hong Hua, Guo, Z.C.
Format: Article
Language:English
Subjects:
Bonding strength
Brazing alloys
BRAZING FILLER METAL
COATINGS
COPPER ALLOYS (40 TO 99.3 CU)
Copper base alloys
COPPER TIN ALLOYS
DIAMOND TOOLS
DIAMONDS
Grit
MACHINE TOOLS
Microstructure
MICROSTRUCTURES
Titanium
TITANIUM CARBIDE
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Summary:Cu-Sn-Ti brazing alloys are gaining importance as active brazing alloys for brazing diamond tools. The microstructure at the interface between diamond or Ti-coated diamond grits and Cu-Sn-Ti brazing alloy and bonding strength have been investigated in this paper. The results show that TiC layer forms between diamond and alloy matrix during the brazing process and Sn- and Ti-based intermetallic phase forms between TiC and the bonding matrix. And compound SnTi3 forms between the Ti-coated diamond grits and Cu-Sn-Ti brazing alloy. Furthermore, the bonding strength between Ti-coated diamond grits and brazing alloy is higher than that between diamond grits and brazing alloy.
ISSN:1013-9826
1662-9795
1662-9795
DOI:10.4028/www.scientific.net/KEM.487.199