Properties of laser fabricated nanostructured Cu/diamond-like carbon composite

Copper/diamond-like carbon (DLC) was fabricated using pulsed laser deposition, and the effects of copper on the properties of DLC composites were studied. Experimental results showed that the presence of copper promoted surface evolution through the formation of nanoclusters, accentuated the formati...

Full description

Saved in:
Bibliographic Details
Published in:Journal of materials research 2011-11, Vol.26 (21), p.2761-2771
Main Authors: Foong, Y.M., Koh, A.T.T., Lim, S.R., Chua, D.H.C., Ng, H.Y.
Format: Article
Language:English
Subjects:
Adhesion
Analysis
Applied and Technical Physics
Biomaterials
Carbon
Composite materials
Copper
Diamond-like carbon
Electrons
Friction
Inorganic Chemistry
Lasers
Materials Engineering
Materials research
Materials Science
Morphology
Nanocomposites
Nanostructure
Nanostructured materials
Nanotechnology
Optics
Protective coatings
Silver
Spectrum analysis
Studies
Wear resistance
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Copper/diamond-like carbon (DLC) was fabricated using pulsed laser deposition, and the effects of copper on the properties of DLC composites were studied. Experimental results showed that the presence of copper promoted surface evolution through the formation of nanoclusters, accentuated the formation of Si–C but graphitized the diamond bondings of DLC matrix. By considering the interaction of laser with copper/carbon composite target, the presence of copper may have increased the energy absorbed during laser deposition, as envisaged by Saha’s equation. Thus, upon the impingement of ions on substrate during deposition, the carbon and silicon atoms may have been redistributed to form Si–C bonding while the excess energy was released as heat to promote the formation of nanoclusters but graphitize the sp3 bonding in DLC. Although sp3 bonding was reduced with the presence of copper, mechanical characterization showed that the adhesion strength of the composite films was approximately five times higher compared to undoped DLC, as a result of the decrease in internal stress and the formation of Si–C bondings in DLC.
ISSN:0884-2914
2044-5326
DOI:10.1557/jmr.2011.318