European suppliers focusing on tool productivity

The technology roadmap and associated expectation of a concurrent cost-per-function reduction leads to a situation where innovation is simply expected irrespective of cost, while increased productivity is demanded. Equipment (and materials) are now the driving force to satisfy such expectations, whe...

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Bibliographic Details
Published in:Semiconductor international 1999-04, Vol.22 (4), p.95
Main Authors: Bruchez, Jeff, Kelm, Georg
Format: Magazinearticle
Language:English
Subjects:
Failure analysis
Industrywide conditions
Lasers
Productivity
R&D
Research & development
Semiconductors
Silicon wafers
Technological change
Technological planning
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Summary:The technology roadmap and associated expectation of a concurrent cost-per-function reduction leads to a situation where innovation is simply expected irrespective of cost, while increased productivity is demanded. Equipment (and materials) are now the driving force to satisfy such expectations, whether they be in scaling, productivity or wafer size. This acceleration of the technology roadmap to meet cost/performance goals is having a greater impact than envisaged by the industry. At the European level, the Semiconductor Equipment Assessment (SEA) Initiative has an approach operating on both 200 and 300 mm equipment in a phased manner that is generally more in line with the global timing that will occur for the 200-300 mm transition. The industry is migrating toward reduced feature sizes and higher productivity. A move to 300 mm production contains many issues related to cost, technology, standardization, yield, applicability and, above all, timing. The SEA will continue its open and global approach and its preference for a phased and flexible approach that can respond to industry trends and needs.
ISSN:0163-3767