New T-1 bundles bridge gap to T-3.(Technology Information)

Established methods of bundling multiple T-1 circuits do not provide the cost-effective, high-performance, bandwidth-efficient means needed for large-scale deployment of a new multimegabit service. This situation has driven the search for a new class of products able to break through the performance...

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Bibliographic Details
Published in:Network world 1999-10, Vol.16 (43), p.51-51
Main Author: Palmer, Dan
Format: Magazinearticle
Language:English
Subjects:
Bandwidths
Circuits
Copper
Frame relay
Internet access
Planning
T1 communications
T1 lines
T3 communications
T3 lines
Technological change
Technology overview
Virtual private networks
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Summary:Established methods of bundling multiple T-1 circuits do not provide the cost-effective, high-performance, bandwidth-efficient means needed for large-scale deployment of a new multimegabit service. This situation has driven the search for a new class of products able to break through the performance bottleneck of previous packet-based multilink solutions. To accomplish this breakthrough, the prospective product must bundle multiple T-q circuits at wire speeds, using standards-based Multi-Link PPP and Multi-Link Frame Relay protocols. For strong performance and low latency, these products need to segment packets into fragments and transport each fragment over a separate member of the T-1 bundle. The increased robustness available fro a packet-based, multiple-link technologies critical for this new brand of bundled lines because the multilink virtual multimegabit access path must continue to operate reliably even if one of the links in the bundle is experiencing error, test or failure conditions. Removing the problem circuit from the bundle, decreasing the bundle bandwidth accordingly, and then reinstating the circuit once the anomaly has cleared will solve the reliability issue.
ISSN:0887-7661