Preventing Contamination-Caused Assembly Failure

Contamination "favors" moisture absorption, and with it comes electrochemical migration and corrosion-induced leakage currents. Studies indicate a higher malfunctioning rate among some Pb-free alloys because of the presence of dendrites, particularly "edge-triggered" circuits. Mo...

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Bibliographic Details
Published in:Circuits Assembly 2009-06, Vol.20 (6), p.42
Main Author: Wack, Harald
Format: Magazinearticle
Language:English
Subjects:
Assembly lines
Circuits
Contamination
Design
Integrated circuits
ISO standards
Moisture absorption
Prevention
Soldering
Online Access:Get full text
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Summary:Contamination "favors" moisture absorption, and with it comes electrochemical migration and corrosion-induced leakage currents. Studies indicate a higher malfunctioning rate among some Pb-free alloys because of the presence of dendrites, particularly "edge-triggered" circuits. Moreover, the intrinsic conductivity and electrodiffusion effect of most contamination lowers the surface resistance.
ISSN:1054-0407