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CCGA design variables and their effects on reliability

The design variables of ceramic column grid array (CCGA) packages and their effects on reliability were discussed. CCGA has a wide range of design variables because of the variety of functions and applications. The variables include ceramic substrate thickness, column array format, lidded or lidless...

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Bibliographic Details
Published in:Circuits Assembly 2002-01, Vol.13 (1), p.66-72
Main Authors: Cole, Marie S, Ingalls, Ellyn, Martin, Gregory B, Milkovich, Cynthia
Format: Magazinearticle
Language:English
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Summary:The design variables of ceramic column grid array (CCGA) packages and their effects on reliability were discussed. CCGA has a wide range of design variables because of the variety of functions and applications. The variables include ceramic substrate thickness, column array format, lidded or lidless and card thickness. Thin ceramic substrates and lidless packages can improve the thermal cycle fatigue life using a full CCGA array. The equivalent reliability, independent of column supplier, of the cast and column last attach solder process (CLASP) in the 1.27 mm pitch format were also demonstrated.
ISSN:1054-0407