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There's Something about Copper
Our original hypothesis - that the credibility may be dependent on grain structure and perhaps indicated by tensile properties - was not substantiated by the data. Although we did identify significant differences in the grain morphology and the behaviors of different electrodeposited coppers, we unf...
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Published in: | Circuits Assembly 2008-09, Vol.19 (9), p.52 |
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Main Author: | |
Format: | Magazinearticle |
Language: | English |
Subjects: | |
Online Access: | Get full text |
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Summary: | Our original hypothesis - that the credibility may be dependent on grain structure and perhaps indicated by tensile properties - was not substantiated by the data. Although we did identify significant differences in the grain morphology and the behaviors of different electrodeposited coppers, we unfortunately found no correlations whatsoever with grain structure, ultimate tensile strength or elongation at break. Last October, we published our first report on the erosion experiment at SMTA International. |
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ISSN: | 1054-0407 |