A new fast, clean process for cutting ceramic substrates

Standard methods for cutting ceramic substrates in electronic applications cannot meet demand in terms of quality and design complexity for various reasons, such as high maintenance costs and low speed. Water-jet-guided laser technology offers an excellent solution, and is well adapted to sensitive...

Full description

Saved in:
Bibliographic Details
Published in:American Ceramic Society bulletin 2005, Vol.84 (1), p.17-18
Main Authors: PERROTTET, Delphine, AMOROSI, Simone, HOUSH, Roy, RICHERZHAGEN, Bernold
Format: Magazinearticle
Language:English
Subjects:
Applied sciences
Building materials. Ceramics. Glasses
Ceramic industries
Ceramics
Chemical industry and chemicals
Electrotechnical and electronic ceramics
Exact sciences and technology
Integrated circuits
Printed circuit boards
Technical ceramics
Technology
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Standard methods for cutting ceramic substrates in electronic applications cannot meet demand in terms of quality and design complexity for various reasons, such as high maintenance costs and low speed. Water-jet-guided laser technology offers an excellent solution, and is well adapted to sensitive materials such as ceramics. The current method for separating substrates is scribe-and-break. The water-jet-guided laser is a hybrid technology that combines a laser beam and a thin water jet used as an optical waveguide. The laser grooves a line in the material, and a breaking step achieves the through-cut. Singulation is thus performed at higher speeds and lower costs than by other cutting technologies, thereby avoiding problems including mechanical and thermal damage. The technology also offers the possibility of processing complete electronic packages.
ISSN:0002-7812
1945-2705