PROTECTION OF ELECTRIC AND ELECTRONIC EQUIPMENT

Potting compounds are sealants or adhesives that are used to encapsulate sensitive electronic components such as chips and sensors, printed circuit boards, integrated circuits, semiconductors, and other components. They are designed to protect these electronic assemblies from challenging environment...

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Bibliographic Details
Published in:Adhesives & Sealants Industry 2023-01, Vol.30 (1), p.6-6
Main Authors: Viñas, Sara Liébana, Stohrer, Ingo
Format: Magazinearticle
Language:English
Subjects:
Adhesives
Automobile industry
Autonomous navigation
Circuit boards
Circuit design
Circuit protection
Consumer electronics
Contaminants
Electric vehicles
Electrical insulation
Electronic assemblies
Electronic components
Electronic equipment
Electronic systems
Electronics industry
Flexibility
Integrated circuits
Moisture effects
Potting compounds
Raw materials
Sealers
Sealing compounds
Silicones
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Summary:Potting compounds are sealants or adhesives that are used to encapsulate sensitive electronic components such as chips and sensors, printed circuit boards, integrated circuits, semiconductors, and other components. They are designed to protect these electronic assemblies from challenging environmental conditions, acting as a barrier against contaminants like water/moisture and chemicals. The potting protective layer/matrix is an integral part of the electrical unit, providing the additional benefits of electrical insulation, enhanced mechanical strength, vibration resistance, and heat dissipation. The growing popularity of electric vehicles is generating promising new opportunities for the potting compound industry as well. The production of electric vehicles is gaining momentum across the entire globe. In turn, the increased integration of electronic systems in vehicles, such as navigation and autonomous driving, will amplify the product demand across the automotive sector. Furthermore, energy and solar power applications are set to capture a substantial share of the potting compound industry in the future.
ISSN:1070-9592
2328-1049