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Structural, chemical, and electrical parameters of Au/MoS 2 /n-GaAs metal/2D/3D hybrid heterojunction
In this study, Au/MoS /n-GaAs heterojunction is fabricated with single MoS layer and its structural, chemical and electrical parameters are investigated using X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and measurement of current-voltage (I-V) characteristics at room temperature....
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Published in: | Journal of colloid and interface science 2019-08, Vol.550, p.48 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Online Access: | Get full text |
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Summary: | In this study, Au/MoS
/n-GaAs heterojunction is fabricated with single MoS
layer and its structural, chemical and electrical parameters are investigated using X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and measurement of current-voltage (I-V) characteristics at room temperature. XRD and XPS analysis results confirm the formation of MoS
layer on the n-GaAs surface. The electrical properties of the Au/MoS
/n-GaAs heterojunction are compared with those of the Au/n-GaAs Schottky junction. Interestingly, the heterojunction possesses a higher barrier height, lower leakage current and higher rectification ratio, in comparison with the Schottky junction. The shunt resistance (R
) and series resistance (R
) are also assessed for both the junctions. Moreover, the ideality factor (n), barrier height (Φ
) and series resistance (R
) are evaluated using Norde, Cheung's and surface potential (Ψ
-V) plots and the results are well-matched. Furthermore, the current transport mechanism is analyzed based on the forward bias I-V data. Lastly, the Poole-Frenkel emission conduction mechanism is employed to control the reverse bias I-V behavior of both Au/n-GaAs Schottky junction and Au/MoS
/n-GaAs heterojunction. The results demonstrate that the Au/MoS
/n-GaAs heterojunction fabricated using a simple technique is suitable for high-quality electronic and optoelectronic device applications. |
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ISSN: | 1095-7103 |
DOI: | 10.1016/j.jcis.2019.04.061 |