Impact of a High-Power Light-Emitting Diode Unit With Reduced Curing Times on the Shear Bond Strength of Orthodontic Brackets and Their Adhesive Remnant Index Scores

• Published in: Curēus (Palo Alto, CA) CA), 2023-06, Vol.15 (6), p.e39855-e39855
• Main Authors: Rohini, Neelapala, Sunil, Ghanta, Ram, Rsvm Raghu, Ranganayakulu, Inuganti, Vijaya Krishna, Balanaga
• Format: Article
• Language: English
• Subjects: Adhesives; Bond strength; Curing; Dental enamel; Dentistry; Kruskal-Wallis test; Light emitting diodes; Orthodontics; Sample size; Teeth; Variance analysis
• ISSN: 2168-8184; 2168-8184
• DOI: 10.7759/cureus.39855

This study aims to evaluate the curing time minimally required for bonding stainless-steel (SS) brackets using a high-power light-emitting diode (LED) light curing unit (LCU) and examine the debonded enamel surface for adhesive remnant. Based on the LED LCU and curing time employed, 80 human maxillary first premolar teeth were equally segregated into four groups. Three groups were cured using a high-power LED unit (Guilin Woodpecker Medical Instrument Co., Ltd., Guilin, Guangxi, China) for one, two, and three seconds. The fourth group served as a control and was bonded with another intensive LED unit (Elipar™ S10 LED Curing Light; 3M, Saint Paul, Minnesota, United States) for 20 seconds. Transbond™ XT Light Cure Adhesive (3M, United States) adhesive was used for bonding the SS brackets. All the samples were exposed to shear bond strength (SBS) testing after a 24-hour immersion period in distilled water at 37°C. A stereomicroscope was used to examine and score the adhesive remnant on the debonded surface using a modified adhesive remnant index (ARI). Kruskal-Wallis-ANOVA and post-hoc Mann-Whitney U tests for multiple pairwise comparisons were performed to analyze the data. Time and intensity significantly affected the SBS (P