Experimental and Theoretical Investigation on Heat Transfer Enhancement in Micro Scale Using Helical Connectors

• Published in: Materials 2024-02, Vol.17 (5), p.1067
• Main Authors: Abraham, Malyne, Abboud, Zachary, Arriaga, Gabriel Herrera, Tom, Kendall, Austin, Samuel, Vafaei, Saeid
• Format: Article
• Language: English
• Subjects: Carbon; Computer software industry; Conductivity; Connectors; Cooling; Cooling systems; Deionization; Diamonds; Efficiency; Electric properties; Electronic components industry; Fluid dynamics; Fluid flow; Fluids; Heat conductivity; Heat transfer; Heat transfer coefficients; Investigations; Management systems; Microchannels; Molecular motion; Nanofluids; Nanoparticles; Particle size; Physical properties; Reynolds number; Secondary flow; Sedimentation & deposition; Thermal analysis; Thermal conductivity; Thermal management; Viscosity; Working fluids
• ISSN: 1996-1944; 1996-1944
• DOI: 10.3390/ma17051067

Microscale electronics have become increasingly more powerful, requiring more efficient cooling systems to manage the higher thermal loads. To meet this need, current research has been focused on overcoming the inefficiencies present in typical thermal management systems due to low Reynolds numbers within microchannels and poor physical properties of the working fluids. For the first time, this research investigated the effects of a connector with helical geometry on the heat transfer coefficient at low Reynolds numbers. The introduction of a helical connector at the inlet of a microchannel has been experimentally tested and results have shown that this approach to flow augmentation has a great potential to increase the heat transfer capabilities of the working fluid, even at low Reynolds numbers. In general, a helical connector can act as a stabilizer or a mixer, based on the characteristics of the connector for the given conditions. When the helical connector acts as a mixer, secondary flows develop that increase the random motion of molecules and possible nanoparticles, leading to an enhancement in the heat transfer coefficient in the microchannel. Otherwise, the heat transfer coefficient decreases. It is widely known that introducing nanoparticles into the working fluids has the potential to increase the thermal conductivity of the base fluid, positively impacting the heat transfer coefficient; however, viscosity also tends to increase, reducing the random motion of molecules and ultimately reducing the heat transfer capabilities of the working fluid. Therefore, optimizing the effects of nanoparticles characteristics while reducing viscous effects is essential. In this study, deionized water and deionized water-diamond nanofluid at 0.1 wt% were tested in a two-microchannel system fitted with a helical connector in between. It was found that the helical connector can make a great heat transfer coefficient enhancement in low Reynolds numbers when characteristics of geometry are optimized for given conditions.