Poly(ester imide)s with Low Linear Coefficients of Thermal Expansion and Low Water Uptake (VII): A Strategy to Achieve Ultra-Low Dissipation Factors at 10 GHz

• Published in: Polymers 2024-02, Vol.16 (5), p.653
• Main Authors: Hasegawa, Masatoshi, Fukuda, Taro, Ishii, Junichi
• Format: Article
• Language: English
• Subjects: Aromatic compounds; Cellular telephones; Circuit boards; Copper; Diamines; Dielectric properties; Dissipation factor; Glass transition temperature; Heat resistance; Naphthalene; Physical factors; Polyimide resins; Substrates; Temperature; Thermal expansion
• ISSN: 2073-4360; 2073-4360
• DOI: 10.3390/polym16050653

In this study, a series of ester-linked tetracarboxylic dianhydrides (TCDAs) with 2,6-naphthalene-containing longitudinally extended structures consisting of different numbers of aromatic rings ( = 6-8) was synthesized to obtain novel modified polyimides, poly(ester imide)s (PEsIs). These TCDAs were fully compatible with the conventional manufacturing processes of conventional polyimide (PI) systems. As an example, the PEsI film obtained from the ester-linked TCDA ( = 8) and an ester-linked diamine achieved unprecedented outstanding dielectric properties without the support of fluorinated monomers, specifically an ultra-low dissipation factor (tan ) of 0.00128 at a frequency of 10 GHz (50% RH and 23 °C), in addition to an extremely high glass transition temperature ( ) of 365 °C, extremely low linear coefficient of thermal expansion (CTE) of 6.8 ppm K , suppressed water uptake (0.24%), requisite film ductility, and a low haze. Consequently, certain PEsI films developed in this study are promising candidates for heat-resistant dielectric substrates for use in 5G-compatible high-speed flexible printed circuit boards (FPCs). The chemical and physical factors denominating tan are also discussed.