Kinetic Study of Anaerobic Adhesive Curing on Copper and Iron Base Substrates

Anaerobic adhesives (AAs) cure at room temperature in oxygen-deprived spaces between metal substrates. The curing process is significantly influenced by the type of metal ions present. This study investigates the curing kinetics of a high-strength AA on iron and copper substrates using differential...

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Bibliographic Details
Published in:Materials 2024-06, Vol.17 (12), p.2886
Main Authors: Abenojar, Juana, López de Armentia, Sara, Del Real, Juan Carlos, Martínez, Miguel Angel
Format: Article
Language:English
Subjects:
Activation energy
Adhesion
Adhesives
Aluminum
Calorimetry
Chromatography
Comparative analysis
Copper
Curing
Fourier transforms
Free radicals
Industrial applications
Iron
Kinetics
Medical research
Medicine, Experimental
Polymerization
Polymers
Radiation
Room temperature
Spectrum analysis
Steel
Substrates
Temperature
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Summary:Anaerobic adhesives (AAs) cure at room temperature in oxygen-deprived spaces between metal substrates. The curing process is significantly influenced by the type of metal ions present. This study investigates the curing kinetics of a high-strength AA on iron and copper substrates using differential scanning calorimetry (DSC). The activation energy and kinetic parameters were determined with different empiric models, revealing that curing on copper is faster and more complete compared to iron. The findings suggest that copper ions lower the activation energy required for curing, enhancing the adhesive's performance. This research addresses the gap in understanding how metal ions affect AA curing kinetics, offering valuable insights for optimizing adhesive formulations for industrial applications.
ISSN:1996-1944
1996-1944
DOI:10.3390/ma17122886