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Thermal Conductance of the 2D MoS2/h-BN and graphene/h-BN Interfaces
Two-dimensional (2D) materials and their corresponding van der Waals heterostructures have drawn tremendous interest due to their extraordinary electrical and optoelectronic properties. Insulating 2D hexagonal boron nitride ( h -BN) with an atomically smooth surface has been widely used as a passiva...
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Published in: | Scientific reports 2017-03, Vol.7 (1), p.43886-43886, Article 43886 |
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Main Authors: | , , , , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Two-dimensional (2D) materials and their corresponding van der Waals heterostructures have drawn tremendous interest due to their extraordinary electrical and optoelectronic properties. Insulating 2D hexagonal boron nitride (
h
-BN) with an atomically smooth surface has been widely used as a passivation layer to improve carrier transport for other 2D materials, especially for Transition Metal Dichalcogenides (TMDCs). However, heat flow at the interface between TMDCs and
h
-BN, which will play an important role in thermal management of various electronic and optoelectronic devices, is not yet understood. In this paper, for the first time, the interface thermal conductance (G) at the MoS
2
/
h
-BN interface is measured by Raman spectroscopy, and the room-temperature value is (17.0 ± 0.4) MW · m
−2
K
−1
. For comparison, G between graphene and
h
-BN is also measured, with a value of (52.2 ± 2.1) MW · m
−2
K
−1
. Non-equilibrium Green’s function (NEGF) calculations, from which the phonon transmission spectrum can be obtained, show that the lower G at the MoS
2
/
h
-BN interface is due to the weaker cross-plane transmission of phonon modes compared to graphene/
h
-BN. T
h
is study demonstrates that the MoS
2
/
h
-BN interface limits cross-plane heat dissipation, and thereby could impact the design and applications of 2D devices while considering critical thermal management. |
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ISSN: | 2045-2322 2045-2322 |
DOI: | 10.1038/srep43886 |