Crystallization of Electrodeposited Germanium Thin Film on Silicon (100)

• Published in: Materials 2013-11, Vol.6 (11), p.5047-5057
• Main Authors: Abidin, Mastura Shafinaz Zainal, Matsumura, Ryo, Anisuzzaman, Mohammad, Park, Jong-Hyeok, Muta, Shunpei, Mahmood, Mohamad Rusop, Sadoh, Taizoh, Hashim, Abdul Manaf
• Format: Article
• Language: English
• Subjects: Chemical vapor deposition; Crystallization; Electrical engineering; Electrolytes; Molecular beam epitaxy; Semiconductors; Silicon; Solvents; Spectrum analysis; Thin films; Transistors
• ISSN: 1996-1944; 1996-1944
• DOI: 10.3390/ma6115047

We report the crystallization of electrodeposited germanium (Ge) thin films on n-silicon (Si) (100) by rapid melting process. The electrodeposition was carried out in germanium (IV) chloride: propylene glycol (GeCl₄:C₃H₈O₂) electrolyte with constant current of 50 mA for 30 min. The measured Raman spectra and electron backscattering diffraction (EBSD) images show that the as-deposited Ge thin film was amorphous. The crystallization of deposited Ge was achieved by rapid thermal annealing (RTA) at 980 °C for 1 s. The EBSD images confirm that the orientations of the annealed Ge are similar to that of the Si substrate. The highly intense peak of Raman spectra at 300 cm corresponding to Ge-Ge vibration mode was observed, indicating good crystal quality of Ge. An additional sub peak near to 390 cm corresponding to the Si-Ge vibration mode was also observed, indicating the Ge-Si mixing at Ge/Si interface. Auger electron spectroscopy (AES) reveals that the intermixing depth was around 60 nm. The calculated Si fraction from Raman spectra was found to be in good agreement with the value estimated from Ge-Si equilibrium phase diagram. The proposed technique is expected to be an effective way to crystallize Ge films for various device applications as well as to create strain at the Ge-Si interface for enhancement of mobility.