Disassembly Properties of Cementitious Finish Joints Using an Induction Heating Method

Efficient maintenance and upgrading of a building during its lifecycle are difficult because a cementitious finish uses materials and parts with low disassembly properties. Additionally, the reuse and recycling processes during building demolition also present numerous problems from the perspective...

Full description

Saved in:
Bibliographic Details
Published in:Materials 2015-05, Vol.8 (5), p.2433-2453
Main Authors: Ahn, Jaecheol, Noguchi, Takafumi, Kitagaki, Ryoma
Format: Article
Language:English
Subjects:
Buildings
Cements
Construction materials
Demolition
Disassembly
Dismantling
Energy efficiency
Finishes
Finishing
Heat treating
Materials selection
Punching
Resistors
Wire
Citations: Items that this one cites
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Efficient maintenance and upgrading of a building during its lifecycle are difficult because a cementitious finish uses materials and parts with low disassembly properties. Additionally, the reuse and recycling processes during building demolition also present numerous problems from the perspective of environmental technology. In this study, an induction heating (IH) method was used to disassemble cementitious finish joints, which are widely used to join building members and materials. The IH rapidly and selectively heated and weakened these joints. The temperature elevation characteristics of the cementitious joint materials were measured as a function of several resistor types, including wire meshes and punching metals, which are usually used for cementitious finishing. The disassembly properties were evaluated through various tests using conductive resistors in cementitious joints such as mortar. When steel fiber, punching metal, and wire mesh were used as conductive resistors, the cementitious modifiers could be weakened within 30 s. Cementitious joints with conductive resistors also showed complete disassembly with little residual bond strength.
ISSN:1996-1944
1996-1944
DOI:10.3390/ma8052433