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Dynamic tungsten diselenide nanomaterials: supramolecular assembly-induced structural transition over exfoliated two-dimensional nanosheets

A simple and effective method for direct exfoliation of tungsten diselenide (WSe ) into few-layered nanosheets has been successfully developed by employing a low molecular weight adenine-functionalized supramolecular polymer (A-PPG). In this study, we discover A-PPG can self-assemble into a long-ran...

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Published in:Chemical science (Cambridge) 2018-06, Vol.9 (24), p.5452-5460
Main Authors: Muhabie, Adem Ali, Ho, Ching-Hwa, Gebeyehu, Belete Tewabe, Huang, Shan-You, Chiu, Chih-Wei, Lai, Juin-Yih, Lee, Duu-Jong, Cheng, Chih-Chia
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Language:English
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Summary:A simple and effective method for direct exfoliation of tungsten diselenide (WSe ) into few-layered nanosheets has been successfully developed by employing a low molecular weight adenine-functionalized supramolecular polymer (A-PPG). In this study, we discover A-PPG can self-assemble into a long-range, ordered lamellar microstructure on the surface of WSe due to the efficient non-covalent interactions between A-PPG and WSe . Morphological and light scattering studies confirmed the dynamic self-assembly behavior of A-PPG has the capacity to efficiently manipulate the transition between contractile and extended lamellar microstructures on the surface of metallic 1T-phase and semiconducting 2H-phase WSe nanosheets, respectively. The extent of WSe exfoliation can be easily controlled by systematically adjusting the amount of A-PPG in the composites, to obtain nanocomposites with the desired functional characteristics. In addition, the resulting composites possess unique liquid-solid phase transition behavior and excellent thermoreversible properties, revealing the self-assembled lamellar structure of A-PPG functions as a critical factor to manipulate and tailor the physical properties of exfoliated WSe . This newly developed method of producing exfoliated WSe provides a useful conceptual and potential framework for developing WSe -based multifunctional nanocomposites to extend their application in solution-processed semiconductor devices.
ISSN:2041-6520
2041-6539
DOI:10.1039/c8sc01778f