Applicability of Aerosol Deposition Process for flexible electronic device and determining the Film Formation Mechanism with Cushioning Effects

In this paper, we demonstrated the feasibility of the Aerosol Deposition (AD) method which can be adapted as a future fabrication process for flexible electronic devices. On the basis of this method’s noticeable advantages such as room-temperature processing, suitability for mass production, wide ma...

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Bibliographic Details
Published in:Scientific reports 2019-02, Vol.9 (1), p.2166-2166, Article 2166
Main Authors: Lee, Chuljun, Cho, Myung-Yeon, Kim, Myungjun, Jang, Jiyun, Oh, Yoonsub, Oh, Kihoon, Kim, Seunghyun, Park, Byungwook, Kim, Byungkwan, Koo, Sang-Mo, Oh, Jong-Min, Lee, Daeseok
Format: Article
Language:English
Subjects:
639/301/1005/1007
639/301/930
Aerosols
Electronic equipment
Fabrication
Humanities and Social Sciences
multidisciplinary
Random access memory
Science
Science (multidisciplinary)
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Summary:In this paper, we demonstrated the feasibility of the Aerosol Deposition (AD) method which can be adapted as a future fabrication process for flexible electronic devices. On the basis of this method’s noticeable advantages such as room-temperature processing, suitability for mass production, wide material selectivity, and direct fabrication on a flexible substrate, we fabricated and evaluated a flexible conductive bridge random access memory (CBRAM) to confirm the feasibility of this method. The CBRAM was fabricated by the AD-method, and a novel film formation mechanism was observed and analyzed. Considering that the analyzed film formation mechanism is notably different with previously reported for film formation mechanisms of the AD method, these results of study will provide strong guidance for the fabrication of flexible electronic device on ductile substrate.
ISSN:2045-2322
2045-2322
DOI:10.1038/s41598-019-38477-y