Applicability of Aerosol Deposition Process for flexible electronic device and determining the Film Formation Mechanism with Cushioning Effects

In this paper, we demonstrated the feasibility of the Aerosol Deposition (AD) method which can be adapted as a future fabrication process for flexible electronic devices. On the basis of this method’s noticeable advantages such as room-temperature processing, suitability for mass production, wide ma...

Full description

Saved in:
Bibliographic Details
Published in:Scientific reports 2019-02, Vol.9 (1), p.2166-2166, Article 2166
Main Authors: Lee, Chuljun, Cho, Myung-Yeon, Kim, Myungjun, Jang, Jiyun, Oh, Yoonsub, Oh, Kihoon, Kim, Seunghyun, Park, Byungwook, Kim, Byungkwan, Koo, Sang-Mo, Oh, Jong-Min, Lee, Daeseok
Format: Article
Language:English
Subjects:
639/301/1005/1007
639/301/930
Aerosols
Electronic equipment
Fabrication
Humanities and Social Sciences
multidisciplinary
Random access memory
Science
Science (multidisciplinary)
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
cited_by cdi_FETCH-LOGICAL-c474t-7706464497bbbef0a40604a51a09f14f9661b15d98ec1ca31dec157de11e12df3
cites cdi_FETCH-LOGICAL-c474t-7706464497bbbef0a40604a51a09f14f9661b15d98ec1ca31dec157de11e12df3
container_end_page 2166
container_issue 1
container_start_page 2166
container_title Scientific reports
container_volume 9
creator Lee, Chuljun
Cho, Myung-Yeon
Kim, Myungjun
Jang, Jiyun
Oh, Yoonsub
Oh, Kihoon
Kim, Seunghyun
Park, Byungwook
Kim, Byungkwan
Koo, Sang-Mo
Oh, Jong-Min
Lee, Daeseok
description In this paper, we demonstrated the feasibility of the Aerosol Deposition (AD) method which can be adapted as a future fabrication process for flexible electronic devices. On the basis of this method’s noticeable advantages such as room-temperature processing, suitability for mass production, wide material selectivity, and direct fabrication on a flexible substrate, we fabricated and evaluated a flexible conductive bridge random access memory (CBRAM) to confirm the feasibility of this method. The CBRAM was fabricated by the AD-method, and a novel film formation mechanism was observed and analyzed. Considering that the analyzed film formation mechanism is notably different with previously reported for film formation mechanisms of the AD method, these results of study will provide strong guidance for the fabrication of flexible electronic device on ductile substrate.
doi_str_mv 10.1038/s41598-019-38477-y
format article
fullrecord <record><control><sourceid>proquest_pubme</sourceid><recordid>TN_cdi_pubmedcentral_primary_oai_pubmedcentral_nih_gov_6377626</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2185549915</sourcerecordid><originalsourceid>FETCH-LOGICAL-c474t-7706464497bbbef0a40604a51a09f14f9661b15d98ec1ca31dec157de11e12df3</originalsourceid><addsrcrecordid>eNp9kcFu1DAQhiNERau2L8ABWeLCJWAndhxfkFbbLiAVlQOcLccZb1w5drCTwj4Fr4y3W0rhUF9m5Pnm94z_onhJ8FuC6_ZdooSJtsRElHVLOS93z4qTClNWVnVVPX-UHxfnKd3gfFglKBEviuMac45b2pwUv1bT5KxWnXV23qFg0ApiSMGhC5hCsrMNHn2JQUNKyISIjIOftnOAwIGeY_BWox5urQakfJ_TGeJovfVbNA-ANtaNaBPiqO6UPoMelLdpRD_sPKD1koZ8vYcvjcl66aw4MsolOL-Pp8W3zeXX9cfy6vrDp_XqqtSU07nM4ze0oVTwruvAYEVxg6liRGFhCDWiaUhHWC9a0ESrmvQ5Mt4DIUCq3tSnxfuD7rR0I_Qa_ByVk1O0o4o7GZSV_1a8HeQ23Mqm5rypmizw5l4ghu8LpFmONmlwTnkIS5IVaRmjQhCW0df_oTdhiT6vt6cI523Wy1R1oHT-_xTBPAxDsNxbLg-Wy2y5vLNc7nLTq8drPLT8MTgD9QFIueS3EP--_YTsb9Xxuw4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2181778263</pqid></control><display><type>article</type><title>Applicability of Aerosol Deposition Process for flexible electronic device and determining the Film Formation Mechanism with Cushioning Effects</title><source>Publicly Available Content Database</source><source>PubMed Central</source><source>Free Full-Text Journals in Chemistry</source><source>Springer Nature - nature.com Journals - Fully Open Access</source><creator>Lee, Chuljun ; Cho, Myung-Yeon ; Kim, Myungjun ; Jang, Jiyun ; Oh, Yoonsub ; Oh, Kihoon ; Kim, Seunghyun ; Park, Byungwook ; Kim, Byungkwan ; Koo, Sang-Mo ; Oh, Jong-Min ; Lee, Daeseok</creator><creatorcontrib>Lee, Chuljun ; Cho, Myung-Yeon ; Kim, Myungjun ; Jang, Jiyun ; Oh, Yoonsub ; Oh, Kihoon ; Kim, Seunghyun ; Park, Byungwook ; Kim, Byungkwan ; Koo, Sang-Mo ; Oh, Jong-Min ; Lee, Daeseok</creatorcontrib><description>In this paper, we demonstrated the feasibility of the Aerosol Deposition (AD) method which can be adapted as a future fabrication process for flexible electronic devices. On the basis of this method’s noticeable advantages such as room-temperature processing, suitability for mass production, wide material selectivity, and direct fabrication on a flexible substrate, we fabricated and evaluated a flexible conductive bridge random access memory (CBRAM) to confirm the feasibility of this method. The CBRAM was fabricated by the AD-method, and a novel film formation mechanism was observed and analyzed. Considering that the analyzed film formation mechanism is notably different with previously reported for film formation mechanisms of the AD method, these results of study will provide strong guidance for the fabrication of flexible electronic device on ductile substrate.</description><identifier>ISSN: 2045-2322</identifier><identifier>EISSN: 2045-2322</identifier><identifier>DOI: 10.1038/s41598-019-38477-y</identifier><identifier>PMID: 30770846</identifier><language>eng</language><publisher>London: Nature Publishing Group UK</publisher><subject>639/301/1005/1007 ; 639/301/930 ; Aerosols ; Electronic equipment ; Fabrication ; Humanities and Social Sciences ; multidisciplinary ; Random access memory ; Science ; Science (multidisciplinary)</subject><ispartof>Scientific reports, 2019-02, Vol.9 (1), p.2166-2166, Article 2166</ispartof><rights>The Author(s) 2019</rights><rights>This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c474t-7706464497bbbef0a40604a51a09f14f9661b15d98ec1ca31dec157de11e12df3</citedby><cites>FETCH-LOGICAL-c474t-7706464497bbbef0a40604a51a09f14f9661b15d98ec1ca31dec157de11e12df3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.proquest.com/docview/2181778263/fulltextPDF?pq-origsite=primo$$EPDF$$P50$$Gproquest$$Hfree_for_read</linktopdf><linktohtml>$$Uhttps://www.proquest.com/docview/2181778263?pq-origsite=primo$$EHTML$$P50$$Gproquest$$Hfree_for_read</linktohtml><link.rule.ids>230,314,727,780,784,885,25753,27924,27925,37012,37013,44590,53791,53793,75126</link.rule.ids><backlink>$$Uhttps://www.ncbi.nlm.nih.gov/pubmed/30770846$$D View this record in MEDLINE/PubMed$$Hfree_for_read</backlink></links><search><creatorcontrib>Lee, Chuljun</creatorcontrib><creatorcontrib>Cho, Myung-Yeon</creatorcontrib><creatorcontrib>Kim, Myungjun</creatorcontrib><creatorcontrib>Jang, Jiyun</creatorcontrib><creatorcontrib>Oh, Yoonsub</creatorcontrib><creatorcontrib>Oh, Kihoon</creatorcontrib><creatorcontrib>Kim, Seunghyun</creatorcontrib><creatorcontrib>Park, Byungwook</creatorcontrib><creatorcontrib>Kim, Byungkwan</creatorcontrib><creatorcontrib>Koo, Sang-Mo</creatorcontrib><creatorcontrib>Oh, Jong-Min</creatorcontrib><creatorcontrib>Lee, Daeseok</creatorcontrib><title>Applicability of Aerosol Deposition Process for flexible electronic device and determining the Film Formation Mechanism with Cushioning Effects</title><title>Scientific reports</title><addtitle>Sci Rep</addtitle><addtitle>Sci Rep</addtitle><description>In this paper, we demonstrated the feasibility of the Aerosol Deposition (AD) method which can be adapted as a future fabrication process for flexible electronic devices. On the basis of this method’s noticeable advantages such as room-temperature processing, suitability for mass production, wide material selectivity, and direct fabrication on a flexible substrate, we fabricated and evaluated a flexible conductive bridge random access memory (CBRAM) to confirm the feasibility of this method. The CBRAM was fabricated by the AD-method, and a novel film formation mechanism was observed and analyzed. Considering that the analyzed film formation mechanism is notably different with previously reported for film formation mechanisms of the AD method, these results of study will provide strong guidance for the fabrication of flexible electronic device on ductile substrate.</description><subject>639/301/1005/1007</subject><subject>639/301/930</subject><subject>Aerosols</subject><subject>Electronic equipment</subject><subject>Fabrication</subject><subject>Humanities and Social Sciences</subject><subject>multidisciplinary</subject><subject>Random access memory</subject><subject>Science</subject><subject>Science (multidisciplinary)</subject><issn>2045-2322</issn><issn>2045-2322</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><sourceid>PIMPY</sourceid><recordid>eNp9kcFu1DAQhiNERau2L8ABWeLCJWAndhxfkFbbLiAVlQOcLccZb1w5drCTwj4Fr4y3W0rhUF9m5Pnm94z_onhJ8FuC6_ZdooSJtsRElHVLOS93z4qTClNWVnVVPX-UHxfnKd3gfFglKBEviuMac45b2pwUv1bT5KxWnXV23qFg0ApiSMGhC5hCsrMNHn2JQUNKyISIjIOftnOAwIGeY_BWox5urQakfJ_TGeJovfVbNA-ANtaNaBPiqO6UPoMelLdpRD_sPKD1koZ8vYcvjcl66aw4MsolOL-Pp8W3zeXX9cfy6vrDp_XqqtSU07nM4ze0oVTwruvAYEVxg6liRGFhCDWiaUhHWC9a0ESrmvQ5Mt4DIUCq3tSnxfuD7rR0I_Qa_ByVk1O0o4o7GZSV_1a8HeQ23Mqm5rypmizw5l4ghu8LpFmONmlwTnkIS5IVaRmjQhCW0df_oTdhiT6vt6cI523Wy1R1oHT-_xTBPAxDsNxbLg-Wy2y5vLNc7nLTq8drPLT8MTgD9QFIueS3EP--_YTsb9Xxuw4</recordid><startdate>20190215</startdate><enddate>20190215</enddate><creator>Lee, Chuljun</creator><creator>Cho, Myung-Yeon</creator><creator>Kim, Myungjun</creator><creator>Jang, Jiyun</creator><creator>Oh, Yoonsub</creator><creator>Oh, Kihoon</creator><creator>Kim, Seunghyun</creator><creator>Park, Byungwook</creator><creator>Kim, Byungkwan</creator><creator>Koo, Sang-Mo</creator><creator>Oh, Jong-Min</creator><creator>Lee, Daeseok</creator><general>Nature Publishing Group UK</general><general>Nature Publishing Group</general><scope>C6C</scope><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7X7</scope><scope>7XB</scope><scope>88A</scope><scope>88E</scope><scope>88I</scope><scope>8FE</scope><scope>8FH</scope><scope>8FI</scope><scope>8FJ</scope><scope>8FK</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BBNVY</scope><scope>BENPR</scope><scope>BHPHI</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>FYUFA</scope><scope>GHDGH</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>K9.</scope><scope>LK8</scope><scope>M0S</scope><scope>M1P</scope><scope>M2P</scope><scope>M7P</scope><scope>PIMPY</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>Q9U</scope><scope>7X8</scope><scope>5PM</scope></search><sort><creationdate>20190215</creationdate><title>Applicability of Aerosol Deposition Process for flexible electronic device and determining the Film Formation Mechanism with Cushioning Effects</title><author>Lee, Chuljun ; Cho, Myung-Yeon ; Kim, Myungjun ; Jang, Jiyun ; Oh, Yoonsub ; Oh, Kihoon ; Kim, Seunghyun ; Park, Byungwook ; Kim, Byungkwan ; Koo, Sang-Mo ; Oh, Jong-Min ; Lee, Daeseok</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c474t-7706464497bbbef0a40604a51a09f14f9661b15d98ec1ca31dec157de11e12df3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2019</creationdate><topic>639/301/1005/1007</topic><topic>639/301/930</topic><topic>Aerosols</topic><topic>Electronic equipment</topic><topic>Fabrication</topic><topic>Humanities and Social Sciences</topic><topic>multidisciplinary</topic><topic>Random access memory</topic><topic>Science</topic><topic>Science (multidisciplinary)</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Lee, Chuljun</creatorcontrib><creatorcontrib>Cho, Myung-Yeon</creatorcontrib><creatorcontrib>Kim, Myungjun</creatorcontrib><creatorcontrib>Jang, Jiyun</creatorcontrib><creatorcontrib>Oh, Yoonsub</creatorcontrib><creatorcontrib>Oh, Kihoon</creatorcontrib><creatorcontrib>Kim, Seunghyun</creatorcontrib><creatorcontrib>Park, Byungwook</creatorcontrib><creatorcontrib>Kim, Byungkwan</creatorcontrib><creatorcontrib>Koo, Sang-Mo</creatorcontrib><creatorcontrib>Oh, Jong-Min</creatorcontrib><creatorcontrib>Lee, Daeseok</creatorcontrib><collection>Springer Nature OA Free Journals</collection><collection>PubMed</collection><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Health and Medical</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Biology Database (Alumni Edition)</collection><collection>Medical Database (Alumni Edition)</collection><collection>Science Database (Alumni Edition)</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Natural Science Collection</collection><collection>Hospital Premium Collection</collection><collection>Hospital Premium Collection (Alumni Edition)</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>ProQuest Central (Alumni)</collection><collection>ProQuest Central</collection><collection>ProQuest Central Essentials</collection><collection>Biological Science Collection</collection><collection>ProQuest Central</collection><collection>ProQuest Natural Science Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central</collection><collection>Health Research Premium Collection</collection><collection>Health Research Premium Collection (Alumni)</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>ProQuest Health &amp; Medical Complete (Alumni)</collection><collection>ProQuest Biological Science Collection</collection><collection>Health &amp; Medical Collection (Alumni Edition)</collection><collection>Medical Database</collection><collection>ProQuest Science Journals</collection><collection>ProQuest Biological Science Journals</collection><collection>Publicly Available Content Database</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central Basic</collection><collection>MEDLINE - Academic</collection><collection>PubMed Central (Full Participant titles)</collection><jtitle>Scientific reports</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Lee, Chuljun</au><au>Cho, Myung-Yeon</au><au>Kim, Myungjun</au><au>Jang, Jiyun</au><au>Oh, Yoonsub</au><au>Oh, Kihoon</au><au>Kim, Seunghyun</au><au>Park, Byungwook</au><au>Kim, Byungkwan</au><au>Koo, Sang-Mo</au><au>Oh, Jong-Min</au><au>Lee, Daeseok</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Applicability of Aerosol Deposition Process for flexible electronic device and determining the Film Formation Mechanism with Cushioning Effects</atitle><jtitle>Scientific reports</jtitle><stitle>Sci Rep</stitle><addtitle>Sci Rep</addtitle><date>2019-02-15</date><risdate>2019</risdate><volume>9</volume><issue>1</issue><spage>2166</spage><epage>2166</epage><pages>2166-2166</pages><artnum>2166</artnum><issn>2045-2322</issn><eissn>2045-2322</eissn><abstract>In this paper, we demonstrated the feasibility of the Aerosol Deposition (AD) method which can be adapted as a future fabrication process for flexible electronic devices. On the basis of this method’s noticeable advantages such as room-temperature processing, suitability for mass production, wide material selectivity, and direct fabrication on a flexible substrate, we fabricated and evaluated a flexible conductive bridge random access memory (CBRAM) to confirm the feasibility of this method. The CBRAM was fabricated by the AD-method, and a novel film formation mechanism was observed and analyzed. Considering that the analyzed film formation mechanism is notably different with previously reported for film formation mechanisms of the AD method, these results of study will provide strong guidance for the fabrication of flexible electronic device on ductile substrate.</abstract><cop>London</cop><pub>Nature Publishing Group UK</pub><pmid>30770846</pmid><doi>10.1038/s41598-019-38477-y</doi><tpages>1</tpages><oa>free_for_read</oa></addata></record>
fulltext fulltext
identifier ISSN: 2045-2322
ispartof Scientific reports, 2019-02, Vol.9 (1), p.2166-2166, Article 2166
issn 2045-2322
2045-2322
language eng
recordid cdi_pubmedcentral_primary_oai_pubmedcentral_nih_gov_6377626
source Publicly Available Content Database; PubMed Central; Free Full-Text Journals in Chemistry; Springer Nature - nature.com Journals - Fully Open Access
subjects 639/301/1005/1007
639/301/930
Aerosols
Electronic equipment
Fabrication
Humanities and Social Sciences
multidisciplinary
Random access memory
Science
Science (multidisciplinary)
title Applicability of Aerosol Deposition Process for flexible electronic device and determining the Film Formation Mechanism with Cushioning Effects
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T11%3A19%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_pubme&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Applicability%20of%20Aerosol%20Deposition%20Process%20for%20flexible%20electronic%20device%20and%20determining%20the%20Film%20Formation%20Mechanism%20with%20Cushioning%20Effects&rft.jtitle=Scientific%20reports&rft.au=Lee,%20Chuljun&rft.date=2019-02-15&rft.volume=9&rft.issue=1&rft.spage=2166&rft.epage=2166&rft.pages=2166-2166&rft.artnum=2166&rft.issn=2045-2322&rft.eissn=2045-2322&rft_id=info:doi/10.1038/s41598-019-38477-y&rft_dat=%3Cproquest_pubme%3E2185549915%3C/proquest_pubme%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c474t-7706464497bbbef0a40604a51a09f14f9661b15d98ec1ca31dec157de11e12df3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=2181778263&rft_id=info:pmid/30770846&rfr_iscdi=true