High-performance Acetone Soluble Tape Transfer Printing Method for Heterogeneous Integration

A high-performance transfer printing method using a new soluble tape which can be dissolved in acetone is proposed to be used in heterogeneous integration. Si inks array was transferred from SOI wafers onto various substrates without adhesion promoter by this new method which we refer to as the acet...

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Bibliographic Details
Published in:Scientific reports 2019-10, Vol.9 (1), p.15769-7, Article 15769
Main Authors: Zhang, Jiaqi, Wu, Yichang, Li, Zhe, Zhang, Yachao, Peng, Yue, Chen, Dazheng, Zhu, Weidong, Xu, Shengrui, Zhang, Chunfu, Hao, Yue
Format: Article
Language:English
Subjects:
639/166/987
639/301/1005/1007
Acetone
Adhesion
Adhesives
Efficiency
High temperature
Humanities and Social Sciences
Integration
Methods
multidisciplinary
Polydimethylsiloxane
Printing
Science
Science (multidisciplinary)
Semiconductors
Silicon
Substrates
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Summary:A high-performance transfer printing method using a new soluble tape which can be dissolved in acetone is proposed to be used in heterogeneous integration. Si inks array was transferred from SOI wafers onto various substrates without adhesion promoter by this new method which we refer to as the acetone soluble tape (AST) method to compare with other transfer printing methods by using thermal release tape (TRT), water soluble tape (WST) and polydimethylsiloxane (PDMS). By using the AST method, the transfer printing process does not involve interface contention between stamp/inks and inks/receiver substrate so that it maximizes the transfer printing efficiency. Experimental results present the AST method has good performances, and various alien substrates, even curvilinear surfaces, can be selected as receiver substrates by the AST method. To examine the quality of the transferred Si inks, the Si TFTs were fabricated by using the Si membrane transferred by the AST method on sapphire substrate and the devices show the good performance. All the results confirm that the AST method is an effective method in heterogeneous integration.
ISSN:2045-2322
2045-2322
DOI:10.1038/s41598-019-52235-0