Preparation and Properties of Intrinsically Atomic-Oxygen Resistant Polyimide Films Containing Polyhedral Oligomeric Silsesquioxane (POSS) in the Side Chains

• Published in: Polymers 2020-11, Vol.12 (12), p.2865
• Main Authors: Wu, Hao, Zhang, Yan, Guo, Yi-Dan, Qi, Hao-Ran, An, Yuan-Cheng, Jia, Yan-Jiang, Tan, Yao-Yao, Liu, Jin-Gang, Wu, Bo-Han
• Format: Article
• Language: English
• Subjects: Diamines; Dielectric properties; Dimensional stability; Fluence; Fourier transforms; High temperature; Low earth orbits; Mechanical properties; Modulus of elasticity; Molecular structure; Molecular weight; Nitrogen; Phosphorus; Polyhedral oligomeric silsesquioxane; Scanning electron microscopy; Silicon dioxide; Spectrum analysis; Tensile properties; Tensile strength; Thermal expansion; Thermal stability; Weight loss
• ISSN: 2073-4360; 2073-4360
• DOI: 10.3390/polym12122865

The relatively poor atomic-oxygen (AO) resistance of the standard polyimide (PI) films greatly limits the wide applications in low earth orbit (LEO) environments. The introduction of polyhedral oligomeric silsesquioxane (POSS) units into the molecular structures of the PI films has been proven to be an effective procedure for enhancing the AO resistance of the PI films. In the current work, a series of POSS-substituted poly (pyromellitic anhydride-4,4'-oxydianiline) (PMDA-ODA) films (POSS-PI) with different POSS contents were synthesized via a POSS-containing diamine, -[(heptaisobutyl-POSS)propyl]-3,5-diaminobenzamide (DABA-POSS). Subsequently, the effects of the molecular structures on the thermal, tensile, optical, and especially the AO-erosion behaviors of the POSS-PI films were investigated. The incorporation of the latent POSS substituents decreased the thermal stability and the high-temperature dimensional stability of the pristine PI-0 (PMDA-ODA) film. For instance, the PI-30 film with the DABA-POSS content of 30 wt% in the film exhibited a 5% weight loss temperature ( ) of 512 °C and a coefficient of linear thermal expansion (CTE) of 54.6 × 10 /K in the temperature range of 50-250 °C, respectively, which were all inferior to those of the PI-0 film ( = 574 °C; CTE = 28.9 × 10 /K). In addition, the tensile properties of the POSS-containing PI films were also deteriorated, to some extent, due to the incorporation of the DABA-POSS components. The tensile strength ( ) of the POSS-PI films decreased with the order of PI-0 > PI-10 > PI-15 > PI-20 > PI-25 > PI-30, and so did the tensile modulus ( ) and the elongations at break ( ). PI-30 showed the , , and values of 75.0 MPa, 1.55 GPa, and 16.1%, respectively, which were all lower than those of the PI-0 film ( = 131.0 MPa, = 1.88 GPa, = 73.2%). Nevertheless, the incorporation of POSS components obviously increased the AO resistance of the PI films. All of the POSS-PI films survived from the AO exposure with the total fluence of 2.16 × 10 atoms/cm , while PI-0 was totally eroded under the same circumstance. The PI-30 film showed an AO erosion yield ( ) of 1.1 × 10 cm /atom, which was approximately 3.67% of the PI-0 film ( = 3.0 × 10 cm /atom). Inert silica or silicate passivation layers were detected on the surface of the POSS-PI films after AO exposure, which efficiently prevented the further erosion of the under-layer materials.