Free-Standing Composite Films Based on Thiol-Ene and PEDOT: PSS Layers for Optoelectronic Applications

Free-standing composite films were fabricated by combining the plane parallel layers of thiol-ene based on pentaerythritol tetrakis(3-mercaptopropionate)-1,3,5-triallyl-1,3,5-triazine-2,4,6(1H,3H,5H)-trione (PETMP-TTT) UV curable polymer and poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate) (P...

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Bibliographic Details
Published in:Polymers 2021-04, Vol.13 (8), p.1299
Main Authors: Abakevičienė, Brigita, Guobienė, Asta, Jucius, Dalius, Lazauskas, Algirdas
Format: Article
Language:English
Subjects:
Communication
Composite materials
Conducting polymers
Electrical resistivity
Experiments
Interactive computer systems
Market positioning
Mechanical properties
Modulus of elasticity
Morphology
Optoelectronics
Polymers
Tensile strength
Topography
Ultraviolet radiation
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Summary:Free-standing composite films were fabricated by combining the plane parallel layers of thiol-ene based on pentaerythritol tetrakis(3-mercaptopropionate)-1,3,5-triallyl-1,3,5-triazine-2,4,6(1H,3H,5H)-trione (PETMP-TTT) UV curable polymer and poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate) (PEDOT:PSS) conductive polymer. A systematic analysis was performed with the focus on mechanical performance of the free-standing composite films. The PEDOT:PSS/PETMP-TTT composite exhibited higher values of adhesion force compared to the free-standing PETMP-TTT film due to hydrophilic nature of the PEDOT:PSS layer. The composite was found to be highly transparent in the range of 380-800 nm. The Young's modulus and tensile strength of PETMP-TTT were found to be 3.6 ± 0.4 GPa and 19 ± 3 MPa, while for PEDOT:PSS/PETMP-TTT to be 3.5 ± 0.3 GPa and 20 ± 3 MPa, respectively. The sheet resistance values of the PEDOT:PSS layer in the composite film were found to be highly stable after a number of bending iterations with slight increase in sheet resistance from 108 to 118 ± 2 Ω/□. The resultant PEDOT:PSS/PETMP-TTT composite can be further used in optoelectronic applications.
ISSN:2073-4360
2073-4360
DOI:10.3390/polym13081299